Grain boundary grooving and cathode voiding in bamboo-like metallic interconnects by surface drift diffusion under the capillary and electromigration forces
Grain boundary grooving and cathode voiding in bamboo-like metallic interconnects by surface drift diffusion under the capillary and electromigration forces
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在毛细管力和电迁移力下通过表面漂移扩散在竹状金属互连中形成晶界凹槽和阴极空洞
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发表时间：
2005
期刊：
影响因子：
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通讯作者：
O. Akyildiz
中科院分区：
文献类型：
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作者：
T. Ogurtani;O. Akyildiz
从不可逆热力学基本假设出发，引入数学模型，模拟了三明治型薄膜竹线的晶界开槽和阴极空洞化过程。在无电场条件下，对三结点动力学的计算机研究表明，在瞬态初期服从一级反应动力学，在稳态区服从常见的时间规律t '1 scin ~ 4。在恒定电流实验中施加的电场（EF）修改这个时间定律大大高于明确定义的电子风强度（EWI）阈值，并提出了上限的凹槽深度，这与EWI单调下降。低于阈值水平，毛细管制度占主导地位，和EF有GB开槽的一般动力学的影响不大，除了与EWI的总流逝时间的线性增加。本文根据阴极失效时间的概念，推导出了恒压试验阴极失效时间的解析公式。
The process of grain boundary (GB) grooving and cathode voiding in sandwich type thin film bamboo lines are simulated by introducing a mathematical model, which flows from the fundamental postulates of irreversible thermodynamics. In the absence of the electric field, the computer studies on the triple junction kinetics show that it obeys the first order reaction kinetics at early transient stage, which is followed by the familiar time law as t¯1∕4, at the steady state regime. The applied electric field (EF) in constant current experiments modifies this time law drastically above the well-defined electron wind intensity (EWI) threshold, and puts an upper limit for the groove depth, which decreases monotonically with EWI. Below the threshold level, the capillary regime predominates, and EF has little effect on the general kinetics of GB grooving, other than the linear increase in total elapsed time with EWI. An analytical formula for the cathode failure time in constant voltage test is obtained in terms of...