Performance of water-soluble fullerenol as novel functional molecular abrasive grain for polishing nanosurfaces
Performance of water-soluble fullerenol as novel functional molecular abrasive grain for polishing nanosurfaces
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DOI：
10.1016/j.cirp.2009.03.118
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发表时间：
2009-01-01
影响因子：
4.1
通讯作者：
Suzuki, K.
中科院分区：
文献类型：
--
作者：
Takaya, Y.;Tachika, H.;Suzuki, K.
我们提出了一种新的化学机械抛光（CMP）技术，用于作为下一代半导体制造中的铜抛光工艺的平坦化方法。该技术使用水溶性富勒醇，其具有1纳米粒径、分子水平的高水分散性和不含金属等吸引人的特征。化学过程分析揭示了水溶性富勒烯分子作为磨料颗粒的化学和机械功能。实验结果表明，使用C-60（OH）（36）富勒烯醇作为功能性分子磨料颗粒，铜表面粗糙度从20 nm RMS提高到0.6 nm RMS，获得了比传统工艺更好的抛光性能。(c)2009年CIRP。
We propose a novel chemical-mechanical polishing (CMP) technique for use as the planarization method in the Cu damascene process for the fabrication of next-generation semiconductors. Water-soluble fullerenol, which has attractive features such as a 1-nm grain size, high water dispersibility in a molecular level and metal free, is used in this technique. Chemical process analysis reveals the chemical and mechanical functions of water-soluble fullerenol molecules as abrasive grains. Experimental results show that Cu-Surface roughness was improved from 20 to 0.6 nm RMS by using C-60(OH)(36) fullerenols as functional molecular abrasive grains to achieve better polishing performance than conventional processes. (c) 2009 CIRP.