Microtensile Bond Strength and Interfacial Characterization of 11 Contemporary Adhesives Bonded to Bur-cut Dentin
Microtensile Bond Strength and Interfacial Characterization of 11 Contemporary Adhesives Bonded to Bur-cut Dentin
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DOI：
10.2341/09-076-l
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发表时间：
2010-01-01
影响因子：
2.2
通讯作者：
De Munck, J.
中科院分区：
文献类型：
--
作者：
Sarr, M.;Kane, A. W.;De Munck, J.
Objectives: This study evaluated mechanically and ultra-morphologically 11 different adhesive systems bonded to dentin. Methods: The microtensile bond strength (mu TBS) of 11 contemporary adhesives, including two three-step etch&rinse, three two-step etch&rinse, two two-step self-etch and four one-step self-etch adhesives to dentin, were measured. The resultant interfacial ultra-structure at dentin was characterized by transmission electron microscopy (TEM). Human third molars had their superficial dentin surface exposed, after which a standardized smear layer was produced using a medium-grit diamond bur. The selected adhesives were applied according to their respective manufacturer's instructions for mu TBS measurement after storage in water at 37 degrees C for 24 hours or for TEM interfacial characterization. Results: The mu TBS varied from 11.1 to 63.6 MPa; the highest bond strengths were obtained with the three-step etch&rinse adhesives and the lowest with one-step self-etch adhesives. TEM evaluation showed very different interaction patterns, especially for the self-etch adhesives. "Mild" self-etch adhesives demineralized the dentin surface sufficiently to provide micro-mechanical retention, while preserving hydroxyapatite within the hybrid layer to enable additional chemical interaction. Conclusions: When bonded to dentin, the adhesives with simplified application procedures (in particular, one-step self-etch adhesives) still underperform as compared to conventional three-step adhesives. "Mild" two-step self-etch adhesives that provide additional chemical bonding appear to most optimally combine bonding effectiveness with a simplified application protocol.
