On the Electric Breakdown Behavior of Silicone Gel at Interfaces
On the Electric Breakdown Behavior of Silicone Gel at Interfaces
复制标题
硅凝胶界面电击穿行为的研究
DOI：
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复制
发表时间：
2008
影响因子：
3.1
通讯作者：
A. Claudi
中科院分区：
文献类型：
--
作者：
G. Finis;A. Claudi
固体之间的电应力界面被认为是电绝缘技术的薄弱环节。事实上，这是由于界面层中存在微观空腔或材料密度低的区域而导致的。硅胶是一种柔软、舒适的固体，具有一定的粘性，对任何表面都有良好的适应性，并能够完全填充空隙。由于这些特性，硅胶注定用于有电应力的界面。所提出的工作描述了界面处使用的材料的电击穿行为。研究结果为使用硅胶的电绝缘设计提供了实用信息。
Electrically stressed interfaces between solids are considered as weak points in the electrical insulation technology. This matter of fact is founded in the presence of microscopic cavities or areas with a low material density in the interface layer. Silicone gel, which is a soft and conformable solid with certain tackiness, offers a good adaptation to any surface and the ability to fill in voids completely. Due to these properties the silicone gel is predestinated for the use at electrically stressed interfaces. The work presented, describes the electric breakdown behavior of the material used at interfaces. The results provide practical information for the design of electrical insulation using silicone gel.