A TLM-SPICE interconnection framework for coupled field and circuit analysis in the time domain
A TLM-SPICE interconnection framework for coupled field and circuit analysis in the time domain
复制标题
用于时域耦合场和电路分析的 TLM-SPICE 互连框架
DOI：
10.1109/tmtt.2002.805199
复制
发表时间：
2002
影响因子：
4.3
通讯作者：
W. Hoefer
中科院分区：
文献类型：
--
作者：
P. So;W. Hoefer
A general SPICE-transmission-line matrix (TLM) interconnection framework has been developed. The connection algorithm is based on the representation of the TLM network by equivalent Thevenin and/or Norton sources. Fundamental issues such as source equivalence and SPICE-TLM interconnection options have been examined. The framework opens new and far-reaching possibilities for hybrid global microwave and high-speed digital circuit modeling in the time domain because it combines the extensive circuit and device models of SPICE with general three-dimensional field solutions.
