Single-Side Fabricated Pressure Sensors for IC-Foundry-Compatible, High-Yield, and Low-Cost Volume Production
Single-Side Fabricated Pressure Sensors for IC-Foundry-Compatible, High-Yield, and Low-Cost Volume Production
复制标题
用于 IC 代工兼容、高产量和低成本批量生产的单面制造压力传感器
DOI：
10.1109/led.2011.2147272
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发表时间：
2011-07-01
影响因子：
4.9
通讯作者：
Li, Xinxin
中科院分区：
文献类型：
--
作者：
Wang, Jiachou;Li, Xinxin
在这封信中，提出并开发了一种用于批量生产压力传感器的低成本、高产量的新制造技术。 IC代工兼容工艺仅从（111）硅晶圆的正面进行，无需双面对准曝光、晶圆键合和双面抛光晶圆。采用基于单晶圆的单面体微加工技术，传感器芯片尺寸小至0.6 mm × 0.6 mm，有利于低成本高通量IC代工批量制造。与传统双面微加工方法通过背面深蚀刻确定压力传感膜片厚度相比，正面微加工方案采用正面浅蚀刻，可以对厚度进行更精确和均匀的控制，从而提高良率。所制作的 750 kPa 量程传感器的灵敏度为 0.087 mV/kPa，非线性度为 ±0.09%FS，偏移温度系数 (TCO) 低至 -0.032%/ °C·FS。凭借新技术，传感器在汽车和消费电子应用中前景广阔。
In this letter, a new low-cost and high-yield manufacturing technique for volume production of pressure sensors is proposed and developed. The IC-foundry-compatible process is conducted only from the front side of (111) silicon wafers, without double-sided alignment exposure, wafer bonding, and double-sided polished wafers needed. With the single-wafer-based single-side bulk-micromachining technique, the sensor chip size is as small as 0.6 mm × 0.6 mm that facilitates low-cost high-throughput IC-foundry batch fabrication. Compared with the conventional double-sided micromachining approach where the pressure-sensing diaphragm thickness is determined by back-side deep etching, the front-side micromachining scheme uses front-side shallow etching that provides more precise and uniform control to the thickness for higher yield. 0.087-mV/kPa sensitivity and ±0.09%FS nonlinearity are measured for the fabricated 750-kPa range sensor, and the temperature coefficient of offset ( TCO) is as low as -0.032%/ °C ·FS. With the new technique, the sensors are promising in automotive and consumer electronics applications.