Fabrication of air bridges using electron beam lithography

Fabrication of air bridges using electron beam lithography
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DOI:
10.1116/1.1539062
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发表时间:
2003-01
影响因子:
1.4
通讯作者:
Michael A. Gritz;M. Metzler;J. Moser;D. Spencer;G. Boreman
Michael A. Gritz;M. Metzler;J. Moser;D. Spencer;G. Boreman
中科院分区:
工程技术4区
文献类型:
--
作者:
Michael A. Gritz;M. Metzler;J. Moser;D. Spencer;G. Boreman

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MEMS器件的设计和制造技术类似于超大规模集成电路(VLSI)。并且可以通过传统的批量加工方法制造。制造的容易性和超大规模集成电路MEMS器件的不断发展使工程师能够实现传感器和换能器的集成化。这种进步的一个例子是MEMS加速度计,现在是最大的sin MEMS应用之一,其结合在气囊中。MEMS器件不一定意味着系统工作在射频频率。在许多MEMS器件中,微机电操作仅仅用于致动或调整另一个射频器件。这种装置的示例是可变电容器简单开关。对于图1所示的空气桥,底部金属触点形成共面波导~CPW!传输线利用分布式MEMS传输线DMTL设计了一个射频开关。对于DMTL,中心导体上的空气桥以标准配置操作。当在共面波导传输线的中心导体上施加偏压时,电荷分布使得中心导体与空气桥之间产生静电力,该静电力吸引空气桥。
MEMS devices are designed and fabricated by techniq similar to those of very large scale integration ~VLSI! and can be manufactured by traditional batch processing m ods. The ease of manufacture and the increased develop of VLSI MEMS devices allow engineers to miniaturize se sors and transducers. One example of such an advance is in the MEMS accelerometer, now one of the largest sin MEMS applications with its incorporation in air bags. A MEMS device does not necessarily imply that the system operating at rf frequencies. In many MEMS devices a components, the microelecromechanical operation is u simply for actuation or adjustment of another rf device. O example of such a device would be a variable capacitor simple switch. For the air bridge shown in Fig. 1, the bottom metal co tact forms a coplanar waveguide ~CPW! transmission line. A rf switch has already been designed by using a distribu MEMS transmission line~DMTL !. For DMTL, the air bridges over the center conductor are operated in a par configuration. When a bias voltage is applied to the cen conductor of the CPW transmission line, charge distribu so that an electrostatic force occurs between the center ductor and the air bridge, which attracts the bridge do