Compressive behavior of an electrodeposited nanostructured copper at quasistatic and high strain rates
Compressive behavior of an electrodeposited nanostructured copper at quasistatic and high strain rates
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DOI：
10.1016/s1359-6462(01)01071-5
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发表时间：
2001-09-12
影响因子：
6
通讯作者：
Lu, K
中科院分区：
文献类型：
--
作者：
Jia, D;Ramesh, KT;Lu, K
在4 x 10(-4) s(-1)的准静态应变率和3 x 10(3)-2 x 10(4) s(-1)的高应变率下进行了电沉积纳米结构铜的单轴压缩实验。介绍了无铜的机械行为，包括强度、应变硬化和流动应力的应变率依赖性。 (C) 2001 Acta Materialia Inc. 由 Elsevier Science Ltd 出版。保留所有权利。
Uniaxial compression experiments for an electrodeposited nanostructured copper were performed at quasistatic strain rates of 4 x 10(-4) s(-1) and high strain rates of 3 x 10(3)-2 x 10(4) s(-1). The mechanical behavior of the no-Cu, including strength, strain hardening and strain-rate dependence of flow stress, is presented. (C) 2001 Acta Materialia Inc. Published by Elsevier Science Ltd. All rights reserved.