Physics-of-Failure Lifetime Prediction Models for Wire Bond Interconnects in Power Electronic Modules
Physics-of-Failure Lifetime Prediction Models for Wire Bond Interconnects in Power Electronic Modules
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DOI：
10.1109/tdmr.2012.2235836
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发表时间：
2013-03
影响因子：
2
通讯作者：
Li Yang-;P. Agyakwa;C. M. Johnson
中科院分区：
文献类型：
--
作者：
Li Yang-;P. Agyakwa;C. M. Johnson
本文介绍了电力电子模块中常用的基于失效物理的引线键合互连寿命预测模型。在所讨论的模型中，寿命通常仅由负载温度极值来解释。在温度下所花费的时间对粘结磨损行为和热激活过程引起的损伤去除现象的影响没有得到解决。基于一些不寻常的观察的现象学的考虑突出了需要新的方法来引线键合寿命预测模型，从而激发了一个新的时域损伤为基础的裂纹扩展模型的建议。
This paper presents a review of the commonly adopted physics-of-failure-based life prediction models for wire bond interconnects in power electronic modules. In the discussed models, lifetime is generally accounted for by loading temperature extremes alone. The influence of the time spent at temperature on bond wear-out behavior and damage removal phenomena resulting from thermally activated processes is not addressed. The phenomenological considerations based on some unusual observations highlight the need for new approaches to wire bond life prediction models and thus motivate the proposal of a new time-domain damage-based crack propagation model.