Kinetics of Ag3Sn growth in Ag-Sn-Ag system during transient liquid phase soldering process
Kinetics of Ag3Sn growth in Ag-Sn-Ag system during transient liquid phase soldering process
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DOI：
10.1016/j.actamat.2010.02.018
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发表时间：
2010-05-01
期刊：
影响因子：
9.4
通讯作者：
Johnson, C. M.
中科院分区：
文献类型：
--
作者：
Li, J. F.;Agyakwa, P. A.;Johnson, C. M.
在260 ℃、300 ℃和340 ℃的温度下研究了夹在两片Ag箔之间的Sn薄层的界面反应动力学。对于Sn和Ag之间形成的Ag_3Sn扇形体的增厚生长和剩余Sn的消耗动力学，得到了t（1/n）（n = 3）形式的时间依赖性。这一结果可以用金属间化合物的晶界/熔融通道控制生长模型很好地解释。在这种情况下，Ag原子通过先前形成的Ag 3Sn扇形之间存在的熔融通道的扩散是动力学的控制机制。本文还导出了Ag-Sn-Ag系瞬态液相钎焊的动力学常数，包括反应常数和活化能，以指导实际的Ag-Sn-Ag系瞬态液相钎焊。(C)2010 Acta Materialia Inc.由爱思唯尔有限公司出版。保留所有权利。
The kinetics of the interfacial reaction of a thin layer of Sn sandwiched between two pieces of Ag foil has been investigated at temperatures of 260 degrees C, 300 degrees C and 340 degrees C. A time dependence of the form t(1/n) with n = 3 was obtained for the kinetics of both the consumption of the Sn remaining and the thickening growth of the Ag3Sn scallops formed between Sn and Ag. Such a result can be explained well using the model of grain boundary/molten channel-controlled growth of intermetallic compounds. In this case, the diffusion of Ag atoms through the molten channels existing between the previously formed Ag3Sn scallops is the controlling mechanism for the kinetics. We also report here the derived kinetic constants including reaction constants and the associated activation energy for guiding the practical transient liquid phase soldering of the Ag-Sn-Ag system. (C) 2010 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.