MAPS development for the ALICE ITS upgrade
MAPS development for the ALICE ITS upgrade
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DOI：
10.1088/1748-0221/10/03/c03030
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发表时间：
2015-03
影响因子：
1.3
通讯作者：
P. Yang;G. Aglieri;C. Cavicchioli;P. Chalmet;N. Chanlek;A. Collu;C. Gao;H. Hillemanns;G. Huang;A. Junique;M. Kofarago;M. Keil;T. Kugathasan;D. Kim;J. Kim;A. Lattuca;C. A. M. Tobon;D. Marras;M. Mager;P. Martinengo;G. Mazza;H. Mugnier;L. Musa;C. Puggioni;J. Rousset;F. Reidt;P. Riedler;W. Snoeys;S. Siddhanta;X. Sun;G. Usai;J. V. Hoorne;J. Yi
中科院分区：
文献类型：
--
作者：
P. Yang;G. Aglieri;C. Cavicchioli;P. Chalmet;N. Chanlek;A. Collu;C. Gao;H. Hillemanns;G. Huang;A. Junique;M. Kofarago;M. Keil;T. Kugathasan;D. Kim;J. Kim;A. Lattuca;C. A. M. Tobon;D. Marras;M. Mager;P. Martinengo;G. Mazza;H. Mugnier;L. Musa;C. Puggioni;J. Rousset;F. Reidt;P. Riedler;W. Snoeys;S. Siddhanta;X. Sun;G. Usai;J. V. Hoorne;J. Yi
单片有源像素传感器（MAPS）提供了在商用CMOS工艺中构建具有高空间分辨率和低材料预算的像素探测器和跟踪层的可能性。近年来在map领域取得了重大进展，目前正在考虑将其用于LHC实验的升级。这一贡献将集中在为ALICE内部跟踪系统（ITS）升级而开发的MAPS探测器，并在具有高电阻率外延层的晶圆上采用TowerJazz 180 nm CMOS成像传感器工艺制造。已经开发和生产了几种传感器芯片原型，以优化电荷收集和读出电路。这些芯片已经通过电子测量、放射源和粒子束进行了表征。试验表明，该传感器满足ALICE要求，并于2014年上半年生产出最终尺寸为1.5 × 3 cm2的首批样机。该贡献总结了表征测量，并提出了全尺寸芯片的第一个结果。
Monolithic Active Pixel Sensors (MAPS) offer the possibility to build pixel detectors and tracking layers with high spatial resolution and low material budget in commercial CMOS processes. Significant progress has been made in the field of MAPS in recent years, and they are now considered for the upgrades of the LHC experiments. This contribution will focus on MAPS detectors developed for the ALICE Inner Tracking System (ITS) upgrade and manufactured in the TowerJazz 180 nm CMOS imaging sensor process on wafers with a high resistivity epitaxial layer. Several sensor chip prototypes have been developed and produced to optimise both charge collection and readout circuitry. The chips have been characterised using electrical measurements, radioactive sources and particle beams. The tests indicate that the sensors satisfy the ALICE requirements and first prototypes with the final size of 1.5 × 3 cm2 have been produced in the first half of 2014. This contribution summarises the characterisation measurements and presents first results from the full-scale chips.