Sequential Slot-Die Deposition of Perovskite Solar Cells Using Dimethylsulfoxide Lead Iodide Ink.

Sequential Slot-Die Deposition of Perovskite Solar Cells Using Dimethylsulfoxide Lead Iodide Ink.
复制标题

DOI:
10.3390/ma11112106
复制
发表时间:
2018-10-26
期刊:
Materials (Basel, Switzerland)
影响因子:
--
通讯作者:
Watson T
Watson T
中科院分区:
其他
文献类型:
--
作者:
Burkitt D;Searle J;Worsley DA;Watson T

文献摘要

参考文献

被引文献

相似文献

这项工作展示了碘化铅的顺序沉积,然后是甲基碘化铵,使用工业兼容的槽模涂层方法,在不使用剧毒的二甲基甲酰胺的情况下产生均匀的无针孔薄膜。这是通过对碘化铅层和甲基碘化铵涂层的溶剂体系和涂层条件的精心选择和配方来实现的。溶剂体系的选择对于获得良好的涂层质量、转化为最终的钙钛矿和形成的薄膜形态至关重要。评估了一系列醇类作为槽模涂料中使用的碘化甲基铵配方的溶剂。本文提出了一种用于碘化铅层的二甲基亚砜溶剂体系,其毒性明显低于常用的碘化铅沉积的二甲基甲酰胺溶剂体系,可用于钙钛矿太阳能电池的高通量制造。
This work demonstrates a sequential deposition of lead iodide followed by methylammonium iodide using the industrially compatible slot-die coating method that produces homogeneous pin-hole free films without the use of the highly toxic dimethylformamide. This is achieved through the careful selection and formulation of the solvent system and coating conditions for both the lead iodide layer and the methylammonium iodide coating. The solvent system choice is found to be critical to achieving good coating quality, conversion to the final perovskite and for the film morphology formed. A range of alcohols are assessed as solvent for methylammonium iodide formulations for use in slot-die coating. A dimethylsulfoxide solvent system for the lead iodide layer is shown which is significantly less toxic than the dimethylformamide solvent system commonly used for lead iodide deposition, which could find utility in high throughput manufacture of perovskite solar cells.
DOI: 10.1021/jacs.6b06320
发表时间: 2016-08-17
影响因子: 15
作者:
Jacobsson, T. Jesper;Correa-Baena, Juan-Pablo;Hagfeldt, Anders
通讯作者: Hagfeldt, Anders
DOI: 10.1038/ncomms13831
发表时间: 2016-12-22
影响因子: 16.6
作者:
通讯作者: --
DOI: 10.1038/s41598-017-08642-2
发表时间: 2017-08-11
期刊: Scientific reports
影响因子: 4.6
作者:
Bishop JE;Mohamad DK;Wong-Stringer M;Smith A;Lidzey DG
通讯作者: Lidzey DG
DOI: 10.1016/j.solmat.2012.10.007
发表时间: 2013-02-01
影响因子: 6.9
作者:
Jakubka, Florian;Heyder, Madeleine;Brabec, Christoph J.
通讯作者: Brabec, Christoph J.
DOI: 10.1038/ncomms8497
发表时间: 2015-06-24
影响因子: 16.6
作者:
Eames, Christopher;Frost, Jarvist M.;Barnes, Piers R. F.;O'Regan, Brian C.;Walsh, Aron;Islam, M. Saiful
通讯作者: Islam, M. Saiful