Electromigration in Sn-Pb solder strips as a function of alloy composition
Electromigration in Sn-Pb solder strips as a function of alloy composition
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DOI：
10.1063/1.1319327
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发表时间：
2000-11-15
影响因子：
3.2
通讯作者：
Tu, KN
中科院分区：
文献类型：
--
作者：
Liu, CY;Chen, C;Tu, KN
用薄膜焊带研究了六种不同成分的Sn-Pb钎料在室温附近电流密度为10（5）A/cm（2）时的电迁移。这六种成分是纯Sn、Sn 80 Pb 20、Sn 70 Pb 30、Sn 62 Pb 38（共晶）、Sn 40 Pb 60和Sn 5 Pb 95。共晶合金，具有最低的熔点和高密度的片层界面，被发现有最快的小丘生长。随着成分向两个终相移动，小丘生长速率降低，但在纯Sn中又增加。Sn和Pb之间的界面是质量传输的最快动力学路径，也是引发小丘和空洞形成的地方。(C)2000年美国物理学会。[S0021-8979（00）01823-5]。
Using thin film solder strips, we have investigated the electromigration of six different compositions of Sn-Pb solders at current density of 10(5) A/cm(2) near ambient temperature. The six compositions are pure Sn, Sn80Pb20, Sn70Pb30, Sn62Pb38 (eutectic), Sn40Pb60, and Sn5Pb95. The eutectic alloy, with the lowest melting point and a high density of lamella interfaces, was found to have the fastest hillock growth. As composition moving toward the two terminal phases, the hillock growth rate decreases; but it increases again in pure Sn. The interface between Sn and Pb, being the fastest kinetic path of mass transport, also serves as the place to initiate hillock and void formation. (C) 2000 American Institute of Physics. [S0021-8979(00)01823-5].