Estimation of Liquidus Temperature of Sn-based Alloys and Its Application to the Design of Pb-free Solder

Estimation of Liquidus Temperature of Sn-based Alloys and Its Application to the Design of Pb-free Solder
复制标题

锡基合金液相线温度的估算及其在无铅焊料设计中的应用

DOI:
--
复制
发表时间:
2002
期刊:
Journal of Materials Science : Materials in Electronics Vol.13
影响因子:
--
通讯作者:
C.Q.Wang
C.Q.Wang
中科院分区:
--
文献类型:
--
作者:
H.Ezaki;T.Nambu;R.Ninomiya;Y.Nakahara;C.Q.Wang

文献摘要

被引文献

相似文献