Current challenges and potential directions towards precision microscale additive manufacturing – Part III: Energy induced deposition and hybrid electrochemical processes
Current challenges and potential directions towards precision microscale additive manufacturing – Part III: Energy induced deposition and hybrid electrochemical processes
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DOI：
10.1016/j.precisioneng.2020.12.013
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发表时间：
2020-12
影响因子：
3.6
通讯作者：
S. Chizari;L. Shaw;Dipankar Behera;N. Roy;Ximeng Zheng;R. Panas;J. Hopkins;S. Chen;M. Cullinan
中科院分区：
文献类型：
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作者：
S. Chizari;L. Shaw;Dipankar Behera;N. Roy;Ximeng Zheng;R. Panas;J. Hopkins;S. Chen;M. Cullinan
该系列文章由四部分组成，第三部分讨论了微型增材制造工艺中的挑战和机遇，特别关注能量诱导沉积和电化学工艺。与直接墨水写入（DIW）和基于激光的工艺相比，能量诱导沉积方法可以制造高分辨率、高纵横比和复杂的零件，而混合电化学工艺可用于使用各种导电和光敏材料制造复杂零件。然而，这些工艺的体积吞吐量低于 DIW 和激光工艺。该工艺中已探索的工艺有聚焦离子束诱导沉积 (FIBID)、激光化学气相沉积 (LCVD)、弯月面约束电镀 (MCED) 和激光电化学印刷 (LECP)。可加工材料的范围、特征尺寸分辨率、几何形状和体积吞吐量被用作评估这些工艺当前最先进水平的因素。本文提出了新方法来解决与微型增材制造工艺相关的这些挑战。
The Part III of the four-part series of articles discusses the challenges and opportunities in microscale additive manufacturing processes, specifically focusing on energy-induced deposition and electrochemical processes. Compared to the direct ink write (DIW) and laser-based processes, the energy-induced deposition methods can fabricate high-resolution, high aspect ratio and complex parts, while the hybrid electrochemical process can be used to fabricate complex parts using a wide range of conductive and photoactive materials. However, the volumetric throughput of these processes is lower than their DIW and laser-based counterparts. The processes that have been explored in this process are Focused-ion Beam Induced Deposition (FIBID), Laser Chemical Vapor Deposition (LCVD), Menicus-confined Electrodeposition (MCED) and Laser-Enabled Electrochemical Printing (LECP). The range of processable materials, feature-size resolution, geometry and volumetric throughput are used as factors to evaluate the current state-of-the-art for these processes. Novel approaches have been proposed in the article to address these challenges associated with microscale AM processes.