Thermodynamics and Kinetics of Nucleation

Thermodynamics and Kinetics of Nucleation
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DOI:
10.1007/978-1-4419-9669-5_5
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发表时间:
2011-01-01
期刊:
THEORY AND PRACTICE OF METAL ELECTRODEPOSITION
影响因子:
--
通讯作者:
Zangari, Giovanni
Zangari, Giovanni
中科院分区:
其他
文献类型:
--
作者:
Gamburg, Yuliy D.;Zangari, Giovanni

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在金属电沉积过程中,金属离子在基底处被还原 ,形成在衬底表面上扩散的吸附原子;这些吸附原子 最终会与其他吸附原子接触,形成可能稳定或不稳定的原子团簇。不稳定的团簇最终会消失,而稳定的团簇将能够生长,最终形成薄膜。
In the process of metal electrodeposition metal ions are reduced at the substrate , forming adsorbed atoms that diffuse on the substrate surface; these adatoms will eventually contact other adatoms, forming atomic clusters that may be stable or unstable. Unstable clusters will eventually disappear, while stable clusters will be able to grow, finally forming the film.