CAD/CAM-fabricated inlay restorations: Can the resin-coating technique improve bond strength and internal adaptation?

CAD/CAM-fabricated inlay restorations: Can the resin-coating technique improve bond strength and internal adaptation?
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CAD/CAM 制作的嵌体修复体:树脂涂层技术能否提高粘合强度和内部适应性?

DOI:
10.4012/dmj.2019-309
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发表时间:
2020
影响因子:
2.5
通讯作者:
J. Tagami
J. Tagami
中科院分区:
工程技术3区
文献类型:
--
作者:
S. Rozan;R. Takahashi;T. Nikaido;A. Tichý;J. Tagami

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本研究评估了树脂涂层技术对计算机辅助设计/计算机辅助制造(CAD/CAM)制造嵌体的粘结强度和内部适应性的影响。制备72个近中-咬合-远中(MOD)洞,并根据使用的树脂涂层技术分为3组:未涂层组、G-Premio Bond(1-step)组和Clearfil SE Bond 2+Clearfil Majesty ES Flow(2-step+Flow)组。制造MOD嵌体,并使用RelyX Ultimate(RXU)、G-CEM LinkForce(LinkForce)或Panavia V5(PV 5)进行骨水泥固定。经过5,000次热循环后,将每个样本切片并进行微拉伸粘合强度(MTBS)测试和内部适应性评价。对于未涂覆组,RXU表现出比LinkForce和PV 5更高的MTBS(p<0.05)。所有1步和2步+流动组的MTBS均大于30 MPa。树脂涂层不影响RXU的MTBS,而树脂涂层增加了LinkForce和PV 5的MTBS。所有组中均发现95%以上的无间隙边缘。
This study assessed the effect of the resin-coating technique on the bond strength and internal adaptation of computer-aided design/computer-aided manufacturing (CAD/CAM)-fabricated inlays. Seventy-two mesio-occlusal-distal (MOD) cavities were prepared and distributed into 3 groups according to the resin-coating technique utilized: uncoated group, G-Premio Bond (1-step) group, and Clearfil SE Bond 2+Clearfil Majesty ES Flow (2-step+Flow) group. The MOD inlays were fabricated and cemented with RelyX Ultimate (RXU), G-CEM LinkForce (LinkForce), or Panavia V5 (PV5). After 5,000 thermal cycles, each specimen was sectioned and subjected to microtensile bond strength (MTBS) testing and an internal adaptation evaluation. For the uncoated group, RXU exhibited higher MTBS than LinkForce and PV5 (p<0.05). The MTBS of all 1-step and 2-step+Flow groups was greater than 30 MPa. Resin coating did not influence the MTBS of RXU, whereas resin coating increased the MTBS of LinkForce and PV5. More than 95% gap-free margins were found in all groups.
使用两种固化模式,双固化树脂水门汀与涂有一体式粘合剂系统的牙本质树脂的微拉伸粘合强度
DOI: --
发表时间: 2010
期刊: Dental Materials Journal 29
影响因子: --
作者:
Takahashi R;Nikaido T;Tagami J;他2人
通讯作者: 他2人