Nanosecond pulse laser scribing using Bessel beam for single shot removal of transparent conductive oxide thin film
Nanosecond pulse laser scribing using Bessel beam for single shot removal of transparent conductive oxide thin film
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DOI：
10.1016/j.ijheatmasstransfer.2016.11.088
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发表时间：
2017-04-01
影响因子：
5.2
通讯作者：
Fushinobu, Kazuyoshi
中科院分区：
文献类型：
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作者：
Kim, Byunggi;Iida, Ryoichi;Fushinobu, Kazuyoshi
为了提高TCO薄膜的加工精度和光学系统的鲁棒性，研究了纳秒激光贝塞尔光束在TCO薄膜上的刻划。采用新型的轴棱锥-凸透镜光学系统，将Nd：YAG激光器的基波（1064 nm）整形为高质量的贝塞尔光束。在本发明的上下文中，光束的空间FWHM仅为1.5 μ m，并且在具有电绝缘的600-700 nm厚的FTO膜上实现了最小宽度为23 μ m的显著精确划线。此外，由于毫米级的临界深焦距，样品定位的鲁棒性大大提高。此外，实验结果表明，整个膜的单镜头去除可以实现使用膜侧照射不同于传统的高斯光束。在此过程中的温度分布计算的数值模型中，我们已经考虑到光束在膜内的传播，给出与高斯光束照射的比较。计算结果表明，在等离子体屏蔽后，只有贝塞尔光束发生自重构，从而可以一次去除整个薄膜。我们的研究结果表明，贝塞尔光束可以用于有效的红外划片显着高品质，而无需选择基板材料。(C)2016爱思唯尔有限公司版权所有。
Nanosecond laser Bessel beam scribing on the TCO thin film was investigated to improve processing precision and robustness of optical system. Fundamental wave (1064 nm) of Nd:YAG laser was shaped into high-quality Bessel beam by using novel optical system consisting of axicons and convex lens. Spatial FWHM of the beam was only 1.5 mu m in the present context, and significantly precise scribing with minimum width of 23 pm was achieved on 600-700 nm-thick FTO film with electrical isolation. Furthermore, due to the critically deep focal length of millimeters-order, robustness on sample positioning was greatly improved. Additionally, experimental results showed that single shot removal of entire film can be achieved using film side irradiation unlike conventional Gaussian beam. Temperature distribution during the process was calculated by a numerical model in which we have taken into account beam propagation inside the film to give comparison with a Gaussian beam irradiation. The calculation results showed that only Bessel beam is self-reconstructed behind plasma shielding so that entire film can be removed by single shot. Our findings suggest that Bessel beam can be used for efficient IR scribing with significantly high quality without selecting substrate material. (C) 2016 Elsevier Ltd. All rights reserved.