Instrument for the measurement of adhesion forces in ultrahigh vacuum surface analysis apparatuses
Instrument for the measurement of adhesion forces in ultrahigh vacuum surface analysis apparatuses
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超高真空表面分析装置中粘附力测量仪器
DOI：
10.1116/1.579274
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发表时间：
1994
期刊：
影响因子：
--
通讯作者：
T. Onzawa
中科院分区：
文献类型：
--
作者：
Kunio Takahashi;Takashi Iiyama;N. Katoh;T. Onzawa
开发了一种直接测量表面分析装置超高真空（UHV）室中附着力的仪器[俄歇电子能谱（AES）、X射线光电子能谱、低能电子衍射等]。它可连接到任何具有开放式法兰、机械手和样品引入系统的 UHV 室。将其连接到 AES 装置（Perkin-Elmer PHI 型号 650）并进行测试。检查了 Au 球和 Si 晶片之间的粘附力。
An instrument for direct measurement of the adhesion forces in the ultrahigh vacuum (UHV) chamber of surface analysis apparatus [Auger electron spectroscopy (AES), x‐ray photoelectron spectroscopy, low‐energy electron diffraction, etc.] was developed. It is attachable to any UHV chamber which has a open flange, a manipulator, and a specimen introduction system. It was attached to an AES apparatus (Perkin‐Elmer PHI model 650) and tested. The adhesion force between the Au ball and Si wafers was examined.