Novel ESD protection structure with embedded SCR LDMOS for smart power technology

Novel ESD protection structure with embedded SCR LDMOS for smart power technology
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DOI:
10.1109/relphy.2002.996629
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发表时间:
2002-08
期刊:
2002 IEEE International Reliability Physics Symposium. Proceedings. 40th Annual (Cat. No.02CH37320)
影响因子:
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通讯作者:
Jian-Hsing Lee;J. Shih;C.S. Tang;Kun Liu;Y.H. Wu;R. Shiue;T. Ong;Y.K. Peng;J. Yue
Jian-Hsing Lee;J. Shih;C.S. Tang;Kun Liu;Y.H. Wu;R. Shiue;T. Ong;Y.K. Peng;J. Yue
中科院分区:
其他
文献类型:
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作者:
Jian-Hsing Lee;J. Shih;C.S. Tang;Kun Liu;Y.H. Wu;R. Shiue;T. Ong;Y.K. Peng;J. Yue

文献摘要

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提出了一种适用于智能电源技术的新型ESD保护结构。通过在40 V-LDMOS功率晶体管的漏极区插入P+扩散区,可以在不改变40 V-LDMOS功率晶体管直流I-V特性的情况下,实现嵌入式SCR(ESCR-LDMOS)器件。在漏区插入P+带(N+在NW中)的方法可以将HBM的ESD失效阈值从1 kV提高到6 kV,将MM的ESD失效阈值从100 V提高到350 V。
In this paper, a new robust ESD protection structure has been proposed for smart power technology. By inserting a P+ diffusion into the drain region of 40 V-LDMOS power transistor, the embedded SCR (ESCR-LDMOS) device can be built and without changing any DC I-V characteristics of a 40 V-LDMOS power transistor. It is also found that the method with P+ strap inserted into drain region (N+ in NW) can improve the ESD failure threshold from 1 kV to 6 kV for HBM and from 100 V to 350 V for MM.