Influences of bonding parameters on the tool wear for copper wire bonding
Influences of bonding parameters on the tool wear for copper wire bonding
复制标题
键合参数对铜线键合工具磨损的影响
DOI：
10.1109/eptc.2013.6745803
复制
发表时间：
2013
期刊：
影响因子：
--
通讯作者：
M. Brökelmann
中科院分区：
文献类型：
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作者：
Paul Eichwald;W. Sextro;Simon Althoff;Florian Eacock;M. Schnietz;K. Guth;M. Brökelmann
超声波引线键合是制造电气互连的常用技术。在电力电子领域，由于功率密度要求的不断提高，出现了新的热和电义务。实现这些目标的一种方法是将粗引线键合的引线材料从铝替换为铜。这种材料的变化导致了具有挑战性的任务和问题，例如键合工具的磨损。使用铜线代替铝线的磨损明显更高，并导致可以通过单一工具可靠生产的互连数量的巨大损失。为了减少生产中的设置时间并最大限度地降低成本，需要延长键合工具的使用寿命。因此，本文讨论了粘接参数对磨损的影响。关键问题是哪些任务无法随着工具磨损的增加而完成，例如过程能力的丧失。主要功能是将线材固定在工具槽内、预变形、施加法向力以及向线材传递超声波振荡。为了确定影响最大的因素，改变了四个粘合参数并研究了它们的影响。这些参数是：（I）超声波功率，（II）工具几何形状，（III）切向力传递方式和（IV）循环轨迹。
Ultrasonic wire bonding is a common technology for manufacturing electrical interconnects. In the field of power electronics, new thermal and electrical obligations arose due to increasing power density requirements. One approach to achieve these aims is replacing the wire material for heavy wire bonds from aluminum to copper. This material change leads to challenging tasks and problems, for instance the occurring wear of the bond tool. The wear is significantly higher using copper wire instead of aluminum and results in a dramatic loss in the amount of interconnects which can be produced reliable by a single tool. To reduce setting-up time in the production and minimizing costs, an enlarged bonding tool lifetime is desirable. Therefore, the paper discusses the influences of bonding parameters on the wear. The key question is which of the tasks cannot be fulfilled with increased wear of the tool, e.g. loss of process capability. The main functions are fixing the wire in the tool groove, pre-deformation, applying normal force and transmission of ultrasonic oscillation to the wire. To identify the most affecting factors, four bonding parameters are varied and their influences are investigated. These parameters are: (I) ultrasonic power, (II) tool geometry, (III) the way of tangential force transmission and (IV) loop trajectory.