Dislocation density reduction in multicrystalline silicon solar cell material by high temperature annealing
Dislocation density reduction in multicrystalline silicon solar cell material by high temperature annealing
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DOI:
10.1063/1.2990644
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发表时间:
2008-09-22
影响因子:
4
通讯作者:
Buonassisi, Tonio
中科院分区:
文献类型:
--
作者:
Hartman, Katy;Bertoni, Mariana;Buonassisi, Tonio
We propose and demonstrate a method to remove performance-limiting dislocations from multicrystalline silicon (mc-Si) solar cell material, appropriate for wafers or bricks. Dislocation density reductions of > 95% are achieved in commercial mc-Si via high temperature annealing with an impurity diffusion barrier, with controlled ambient and time-temperature profiles. The dislocation density reduction follows temperature-dependent models developed by Kuhlmann [Proc. Phys. Soc., London, Sect. A 64, 140 (1951)] and Nes [Acta Metall. Mater. 43, 2189 (1995)]. It is believed that higher annealing temperatures (>1170 degrees C) allow dislocation movement unconstrained by crystallographic glide planes, leading to dislocation annihilation within minutes. (C) 2008 American Institute of Physics.