Thermal post-curing as an efficient strategy to eliminate process parameter sensitivity in the mechanical properties of two-photon polymerized materials

Thermal post-curing as an efficient strategy to eliminate process parameter sensitivity in the mechanical properties of two-photon polymerized materials
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DOI:
10.1364/oe.395986
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发表时间:
2020-07-06
期刊:
影响因子:
3.8
通讯作者:
Valdevit, Lorenzo
Valdevit, Lorenzo
中科院分区:
物理与天体物理2区
文献类型:
--
作者:
Bauer, Jens;Izard, Anna Guell;Valdevit, Lorenzo

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