Microstructure and properties of Al/Sip composites for thermal management applications
Microstructure and properties of Al/Sip composites for thermal management applications
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DOI：
10.1007/s10854-015-2973-8
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发表时间：
2015-03
期刊：
影响因子：
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通讯作者：
Z. Cai;Ri-chu Wang;C. Zhang;C. Peng;Linqian Wang
中科院分区：
文献类型：
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作者：
Z. Cai;Ri-chu Wang;C. Zhang;C. Peng;Linqian Wang
高硅颗粒增强铝基复合材料是一种先进的热管理电子封装材料。采用快速凝固和热压工艺制备了不同Si含量的Al/Sip复合材料。获得了无缺陷的细小均匀的显微组织，并且没有检测到有害反应。Al/Sip复合材料的典型热物理性能如热导率和热膨胀系数（CTE）可用作半导体器件的电子封装材料。热膨胀系数随温度的升高而逐渐增大。此外，还测定了复合材料的力学性能。还评价了复合材料的工艺性能（可加工性、可镀性和激光焊接性）。
Aluminum matrix composite reinforced with high amount of Si particle is an advanced electronic packaging material used in thermal management. In this work, Al/Sip composites with different Si contents were prepared by rapid solidification and hot pressing. Fine and homogeneous microstructures with defect-free were achieved, and no detrimental reaction was detected. The typical thermo-physical properties such as the thermal conductivity and coefficient of thermal expansion (CTE) of the Al/Sip composites were acceptable as electronic packaging material for semiconductor devices. The CTE increased gradually with the temperature. Additionally, the mechanical properties of the composites were measured. The technological performance (workability, platability, and laser weldability) of the composites were also evaluated.