Atomic Layer Deposition of Nanostructured Materials for Energy and Environmental Applications
Atomic Layer Deposition of Nanostructured Materials for Energy and Environmental Applications
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DOI：
10.1002/adma.201104129
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发表时间：
2012-02-21
影响因子：
29.4
通讯作者：
Pinna, Nicola
中科院分区：
文献类型：
--
作者：
Marichy, Catherine;Bechelany, Mikhael;Pinna, Nicola
原子层沉积（ALD）是一种薄膜技术，在过去的二十年里，它从一种利基技术迅速发展成为一种成熟的方法。它是纳米材料表面改性和制备复杂纳米结构材料的关键技术。在本进展报告中，在对ALD及其化学进行简短介绍后，将讨论该技术用于制造新型功能材料的多功能性。选定的例子，集中在其使用的纳米结构的工程目标应用在能源转换和存储，并对环境问题，将进行讨论。最后，ALD在材料制造和加工方面面临的挑战也将得到解决。
Atomic layer deposition (ALD) is a thin film technology that in the past two decades rapidly developed from a niche technology to an established method. It proved to be a key technology for the surface modification and the fabrication of complex nanostructured materials. In this Progress Report, after a short introduction to ALD and its chemistry, the versatility of the technique for the fabrication of novel functional materials will be discussed. Selected examples, focused on its use for the engineering of nanostructures targeting applications in energy conversion and storage, and on environmental issues, will be discussed. Finally, the challenges that ALD is now facing in terms of materials fabrication and processing will be also tackled.