Flexible Thermoelectric Devices of Ultrahigh Power Factor by Scalable Printing and Interface Engineering
Flexible Thermoelectric Devices of Ultrahigh Power Factor by Scalable Printing and Interface Engineering
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DOI：
10.1002/adfm.201905796
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发表时间：
2019-11-14
影响因子：
19
通讯作者：
Zhang, Yanliang
中科院分区：
文献类型：
--
作者：
Varghese, Tony;Dun, Chaochao;Zhang, Yanliang
印刷是一种将半导体纳米粒子油墨转化为功能性和柔性器件的通用方法。特别是，热电纳米颗粒是有吸引力的构建块，以制造用于能量收集和冷却应用的柔性设备。然而，印刷器件的性能受到纳米颗粒之间的界面连接不良和由此产生的低载流子迁移率的困扰。虽然许多刚性块体材料已经显示出大于1的热电优值系数ZT，但是开发具有接近1的ZT的柔性材料是一个严格的挑战。在这里，报道了一种可扩展的丝网印刷方法来制造高性能且柔性的热电器件。一个碲基纳米焊料的方法是采用桥的印刷后烧结过程中的BiSbTe颗粒之间的界面。印刷的BiSbTe柔性薄膜表现出室温功率因数为3 mW m（-1）K-2和ZT约1，显着高于柔性薄膜的最佳报道值。完全印刷的热电发电机产生18.8mW cm（-2）的高功率密度，可在80摄氏度的小温度梯度下实现。这种丝网印刷方法直接将热电纳米颗粒转化为高性能和灵活的设备，这是一个重大的飞跃，使热电成为广泛的能量收集和冷却应用的商业可行技术。
Printing is a versatile method to transform semiconducting nanoparticle inks into functional and flexible devices. In particular, thermoelectric nanoparticles are attractive building blocks to fabricate flexible devices for energy harvesting and cooling applications. However, the performance of printed devices are plagued by poor interfacial connections between nanoparticles and resulting low carrier mobility. While many rigid bulk materials have shown a thermoelectric figure of merit ZT greater than unity, it is an exacting challenge to develop flexible materials with ZT near unity. Here, a scalable screen-printing method to fabricate high-performance and flexible thermoelectric devices is reported. A tellurium-based nanosolder approach is employed to bridge the interfaces between the BiSbTe particles during the postprinting sintering process. The printed BiSbTe flexible films demonstrate an ultrahigh room-temperature power factor of 3 mW m(-1) K-2 and ZT about 1, significantly higher than the best reported values for flexible films. A fully printed thermoelectric generator produces a high power density of 18.8 mW cm(-2) achievable with a small temperature gradient of 80 degrees C. This screen-printing method, which directly transforms thermoelectric nanoparticles into high-performance and flexible devices, presents a significant leap to make thermoelectrics a commercially viable technology for a broad range of energy harvesting and cooling applications.