The line tension of grain boundary triple junctions in a Cu-Ni alloy
The line tension of grain boundary triple junctions in a Cu-Ni alloy
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DOI：
10.1016/j.matlet.2014.09.048
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发表时间：
2014-12
影响因子：
3
通讯作者：
Bingbing Zhao;L. Shvindlerman;G. Gottstein
中科院分区：
文献类型：
--
作者：
Bingbing Zhao;L. Shvindlerman;G. Gottstein
晶界三重结本身就是一种缺陷，具有特定的热力学和动力学性质。晶界三结的线张力会引起杂质偏析，而杂质偏析又会影响三线能，从而引起溶质原子对晶界运动的拖拽作用。这可以强烈地影响微观结构的发展，特别是细颗粒和纳米晶材料。我们测量了Cu-Ni合金（Ni含量约2.2%）中由三个随机高角度晶界相交组成的晶界三结的线张力为7.8× 10−9 J/m。这一能量略高于纯铜中类似三重线的线张力。
Grain boundary triple junctions are defects in their own right with specific thermodynamic and kinetic properties. The line tension of a grain boundary triple junction will cause impurity segregation, which, in turn, affects the triple line energy and gives rise to a drag effect of solute atoms on grain boundary motion. This can strongly impact microstructural development, in particular of fine grained and nanocrystalline materials. We measured the line tension of grain boundary triple junctions which comprised the intersection of three random high angle boundaries in a Cu-Ni alloy (Ni content about 2.2%) to be 7.8× 10− 9 J/m. This energy is slightly higher than the line tension of a comparable triple line in pure Cu.