Soldering external connections to thin film systems
Soldering external connections to thin film systems
复制标题
将外部连接焊接至薄膜系统
DOI：
10.1002/sia.740030108
复制
发表时间：
1981
影响因子：
1.7
通讯作者：
J. Morabito
中科院分区：
文献类型：
--
作者：
H. N. Keller;J. Morabito
通过焊料键合与薄膜混合集成电路 (HIC) 进行外部连接比通过固相或热压键合进行连接具有多种优势。本文回顾了这些优点，并讨论了高强度、可靠的薄膜焊点所需的参数。可溶薄膜溶解到焊料中限制了焊料回流时间。最近的研究表明，薄膜在焊料中的溶解速率主要取决于焊接前薄膜热处理的程度、基材表面纹理和薄膜沉积方法。俄歇深度分析数据表明，合金形成和内部氧化减少了焊料回流期间的薄膜溶解。金相切片和化学分析用于识别因金属间化合物形成而产生的弱焊料结合界面。焊料中的锡迅速扩散并与金、钯和铜等可溶性金属反应，形成脆性金属间化合物，如 AuSn4、PdSn4 和 Cu6Sn5。焊料和相关薄膜系统之间的金属间化合物的形成会影响接头强度和可靠性。
External connections to thin film hybrid integrated circuits (HICs) by solder bonding have several advantages over those bonded by solid phase or thermocompression bonding. This paper reviews these advantages and discusses the parameters necessary for high strength, reliable solder joints to thin films. Dissolution of the soluble thin film(s) into solder limits the solder reflow times. Recent work has shown that dissolution rates of thin films in solder depend primarily on the degree of thin film heat treatment prior to soldering, substrate surface texture, and the method of thin film deposition. Auger in-depth profiling data show that alloy formation and internal oxidation reduces film dissolution during solder reflow. Metallographic sectioning and chemical analysis are used to identify weak solder bond interfaces which result from intermetallic formation. Tin from the solder diffuses rapidly and reacts with soluble metals such as gold, palladium and copper to form brittle intermetallics such as AuSn4, PdSn4 and Cu6Sn5. Intermetallic formation between the solder and the thin film systems of interest can affect joint strength and reliability.