Development of a high-temperature inorganic synthetic foam with recycled fly-ash cenospheres for thermal insulation brick manufacturing
Development of a high-temperature inorganic synthetic foam with recycled fly-ash cenospheres for thermal insulation brick manufacturing
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DOI：
10.1016/j.jclepro.2019.118748
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发表时间：
2020-02-10
影响因子：
11.1
通讯作者：
Zhou, Hongyu
中科院分区：
文献类型：
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作者：
Brooks, Adam L.;Shen, Zhenglai;Zhou, Hongyu
在这项研究中，开发了一种由回收的粉煤灰空心微珠（FACs）组成的新型无机合成固体泡沫，它具有低密度、良好的隔热性能和合理的机械强度。制造过程使用在水中稀释的低比例粘土粘结剂材料，通过自然毛细作用辅助的自组装机制，使粉煤灰空心微珠之间形成最小的接触。通过光学和电子显微镜成像证实了微观结构和最小接触的形成。对粉煤灰空心微珠合成固体泡沫（FAC - SSF）材料的热性能和机械性能作为关键材料参数（包括空心微珠粒径和粘土含量）的函数进行了实验研究。建立了一个数值模型，使用三步均匀化方法预测FAC - SSF的有效热导率，该方法考虑了材料内不同的热渗流路径。所开发的无机合成泡沫由于其相对简单、低成本且可扩展的制造工艺、粘结剂材料的最少使用以及相对较高的机械强度和高度可定制的特性，具有用于隔热应用的潜力。（C）2019爱思唯尔有限公司。保留所有权利。
In this study, a novel inorganic synthetic solid foam composed of recycled fly-ash cenospheres (FACs) is developed with low-density, good thermal insulation performance, and reasonable mechanical strength. The manufacturing process utilizes low-fraction clay binder materials diluted in water, enabling a self-assembling mechanism assisted by natural capillary effect to form minimal contacts among the FACs. The microstructure and minimal contact formation were confirmed by optical and electron microscope imaging. Both thermal and mechanical properties of the fly-ash cenosphere synthetic solid foam (FAC-SSF) materials were experimentally studied as functions of key material parameters including cenosphere particle size and clay content. A numerical model was developed to predict the effective thermal conductivity of FAC-SSF using a three-step homogenization method which takes into account different thermal percolation paths within the material. The inorganic synthetic foam developed has the potential for thermal insulation applications taking advantage of their relatively simple, low-cost, and scalable manufacturing process, minimal use of binder materials, and relatively high mechanical strength and highly tailorable properties. (C) 2019 Elsevier Ltd. All rights reserved.