Iterative design and development of remotely-controllable, dynamic compression garment for novel haptic experiences

Iterative design and development of remotely-controllable, dynamic compression garment for novel haptic experiences
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迭代设计和开发可远程控制的动态压缩服装,提供新颖的触觉体验

DOI:
10.1145/3341163.3346935
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发表时间:
2019
期刊:
International Symposiun on Wearable Computers
影响因子:
--
通讯作者:
Holschuh, Brad
Holschuh, Brad
中科院分区:
--
文献类型:
--
作者:
Foo, Esther W;Lee, J. Walter;Ozbek, Simon;Compton, Crystal;Holschuh, Brad

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这项工作包括基于服装的形状记忆合金(SMA)压缩技术的设计和开发,该技术是动态的、低质量的和远程可控的。根据过去的用户研究[1],[2],[3],提出了三个服装设计迭代。所设计的服装系统具有作为研究工具的潜力,用于理解创建所需压缩触觉体验所需的参数;扩大医疗/临床干预的范围;以及在距离遥远的用户之间实现新的互动模式,特别是在远程康复和社交媒介触摸等领域。
This work encompasses the design and development of garment-based shape memory alloy (SMA) compression technology that is dynamic, low-mass, and remotely controllable. Three garment design iterations are presented, consolidated from past user studies [1], [2], [3]. The designed garment system has potential to serve as a research tool for understanding parameters necessary to create a desired compression haptic experience; for broadening the scope of medical/clinical interventions; as well as for enabling new modes of interaction between users separated by distance, especially in areas such as tele-rehabilitation and social mediated touch.
针对新颖触觉​​应用的基于服装的动态压缩的用户体验
DOI: 10.1145/3341163.3347732
发表时间: 2019
期刊: International Symposiun on Wearable Computers
影响因子: --
作者:
Foo, Esther W;Lee, J. Walter;Compton, Crystal;Ozbek, Simon;Holschuh, Brad
通讯作者: Holschuh, Brad
对不同上半身位置应用被动压缩的主观用户体验的调查
DOI: --
发表时间: 2019
期刊: Proceedings of the 2019 Design of Medical Devices Conference
影响因子: --
作者:
Lee, J.W.
通讯作者: Lee, J.W.
DOI: 10.1109/tmech.2014.2328519
发表时间: 2015-06-01
影响因子: 6.4
作者:
Holschuh, Bradley;Obropta, Edward;Newman, Dava
通讯作者: Newman, Dava
隔着距离拥抱
DOI: --
发表时间: 2005
期刊: CHI Extended Abstracts
影响因子: --
作者:
F. Mueller;F. Vetere;M. Gibbs;J. Kjeldskov;S. Pedell;S. Howard
通讯作者: S. Howard
适用于体载软体机器人的低功耗、热暴露最少的形状记忆合金 (SMA) 执行器
DOI: --
发表时间: 2019
期刊: 2019 Design of Medical Devices Conference
影响因子: --
作者:
Ozbek, S.;Foo, E.;Lee, J.W.;Schleif, N.;Holschuh, B.
通讯作者: Holschuh, B.