The Relation between the Thermal Shock Test Lifetime Weibull Distribution Tendency and the Destruction Mode of the Solder Bump Connection

The Relation between the Thermal Shock Test Lifetime Weibull Distribution Tendency and the Destruction Mode of the Solder Bump Connection
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热冲击试验寿命威布尔分布趋势与焊球连接破坏模式的关系

DOI：
10.5104/jiep.12.320
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发表时间：
2009
期刊：
影响因子：
--
通讯作者：
Tubasa Matsumoto
Tubasa Matsumoto
中科院分区：
--
文献类型：
--
作者：
T. Matsuzaki;Qiang Yu;T. Shibutani;Tubasa Matsumoto

文献摘要

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随着电子设备尺寸进一步缩小的需要，确保 CSP（芯片级封装）焊点的可靠性变得越来越重要。需要改进设计技术，不仅包括安装寿命的平均值，还包括寿命的离散度。但寿命离散的原因极其复杂，分析需要认真而艰巨的研究。在本研究中，我们关注了热冲击疲劳测试下焊料凸块连接寿命与威布尔分布不同的趋势。由此，我们提出了一种从样本组中提取不同破坏模式来解释每种趋势的方法。此外，我们还可以从倾角变化与离散因子之间的相关性来阐明对破坏模式的主要影响。这一相关性表明，本研究中CSP焊点阻焊剂开口直径的离散导致了疲劳破坏模式的变化，并导致疲劳寿命开始出现较大离散。此外，有组织的分散因子与破坏模式之间的关系可以使用疲劳裂纹扩展模拟技术来验证。
With the need to further reduce the size of electronic devices, securing the solder joint reliability of CSPs (Chip Scale Packages) is becoming important. There is a demand for an improvement in design technology that includes not only the average of the mounting lifetime but also the dispersion of the lifetime. However, the cause of the dispersion of the lifetime is extremely complicated and the analysis requires serious and difficult study. In this study, we paid attention to that tendency which is different from the Weibull distribution of the lifetime of the solder bump connection under thermal shock fatigue testing. From this, we propose a way of extracting different destruction modes from the sample group to explain each tendency. Moreover, we could clarify the main influences on the destruction mode from the correlation between the change of the inclination and the dispersion factor. This correlation shows that the dispersion in the solder resist opening diameter of the CSP solder joint caused the change of the mode of the fatigue destruction in this research, and brought about the large dispersion begin the fatigue lifetime. Moreover, the relation between the organized dispersion factor and the destruction mode could be verified using a fatigue crack developing simulation technology.