Debonding of photoresists by organic solvents
Debonding of photoresists by organic solvents
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有机溶剂对光刻胶的剥离
DOI：
10.1002/(sici)1097-4628(19960328)59:13
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发表时间：
1996
影响因子：
3
通讯作者：
A. Bhatt
中科院分区：
文献类型：
--
作者：
K. Papathomas;A. Bhatt
氯氟烃（CFC）在印刷电路板工业中已广泛使用了几十年。然而，对它们的臭氧消耗特性的日益关注已经要求禁止使用这些溶剂，并因此带来了对环境友好的替代品的探索。在印刷电路板技术中，甲基氯仿和二氯甲烷已分别被广泛用作显影和剥离用于产生细线电路图案的辐射敏感材料的溶剂。本文描述了未曝光和曝光的T168抗蚀剂在不同温度下在选定溶剂或溶剂混合物中的溶解度。结果解决了这种溶剂基抗蚀剂使用环境友好的替代品去除的容易性。通过使用Fotonic传感器附件监测浸入溶剂中的复合条带的偏转来观察聚合物层从下面的基底的脱粘。脱粘时间被确定为从此类表面去除光致抗蚀剂所需的时间，可以随着温度、溶剂、光致抗蚀剂类型或厚度以及曝光能量而变化。John Wiley & Sons，Inc.
Chlorofluorocarbons (CFCs) have been widely used in the printed circuit board industry for many decades. However, the growing concern regarding their ozone depleting properties has demanded a ban on these solvents and consequently brought forth the search for environmentally friendly alternatives. In printed circuit board technology, methyl chloroform and methylene chloride have been widely utilized as solvents for developing and stripping, respectively, radiation sensitive materials useful in creating fine line circuitry patterns. The solubility of unexposed and exposed T168 resist in selected solvents or solvent mixtures at various temperatures is described here. Results addressing the ease of removal of such solvent based resists using environmentally friendly alternatives are presented. Debonding of the polymer layer from the underlying substrate was observed by monitoring the deflection of the composite strip immersed in the solvent using a Fotonic Sensor accessory. Debonding time, identified as the necessary time to remove the photoresist from such surfaces, can vary with temperature, solvent, photoresist type or thickness, and exposure energy. © 1996 John Wiley & Sons, Inc.