The future of semiconductor manufacturing
The future of semiconductor manufacturing
复制标题
半导体制造的未来
DOI：
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发表时间：
2006
影响因子：
5.7
通讯作者：
D. Pillai
中科院分区：
文献类型：
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作者：
D. Pillai
本文讨论了对工厂集成和自动化解决方案不断变化的需求，这些解决方案旨在解决未来工厂的规模和复杂性。这些要求推动了对真实的突破性解决方案的需求。必须比以往任何时候都更加重视利用主流计算机通信标准和协议开发综合解决方案，以便尽量缩短开发和执行时间，并随着信息技术的发展，不断扩展软件解决方案。随着每一项新技术的发展，制造、工艺、产量、检验、质量和其他关键数据的数量持续呈指数级增长;因此，其收集、存储、访问、共享、分析和保留方法已成为每家公司的主要挑战和战略竞争优势。开发一个灵活的信息系统架构，以安全功能为中心，以阻止可能的病毒感染，也已成为绝对必要的。减少工厂周期时间已经成为一个重要的优先事项，因为在不断变化的市场中，“错误”产品的库存增加（由于较大的晶圆）会导致产品过时和收入损失的高风险。本文还将介绍新一代晶圆厂面临的其他同样重要的业务驱动因素
This paper addresses the evolving requirements for factory integration and automation solutions that are being targeted to address the scale and complexity of the factories of the future. These requirements drive the need for real breakthrough solutions. More than ever before, there must be a strong focus on developing integrated solutions, using mainstream computer communications standards and protocols, so that development and implementation time is minimized and the software solutions are extendible as information technology evolves over time. The volume of manufacturing, process, yield, inspection, quality, and other critical data continues to exponentially increase with each new technology; therefore, its collection, storage, access, sharing, analysis, and retention methods have become a major challenge as well as a strategic competitive advantage for each company. Developing a flexible information systems architecture, with security features taking center stage to thwart possible virus infections, has also become an absolute necessity. Reduction of factory cycle times has become an important priority, as increased inventory (due to larger wafers) of the 'wrong" products in an everchanging marketplace results in a high risk of product obsolescence and loss of revenue. Other equally important business drivers facing the new generation of fabs also will be covered in this article