Residual stress mapping by micro X-ray diffraction: Application to the study of thin film buckling
Residual stress mapping by micro X-ray diffraction: Application to the study of thin film buckling
复制标题
通过微 X 射线衍射绘制残余应力图：在薄膜屈曲研究中的应用
DOI：
10.1051/jp4:20020249
复制
发表时间：
2002
期刊：
影响因子：
--
通讯作者：
H. Padmore
中科院分区：
文献类型：
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作者：
P. Goudeau;P. Villain;N. Tamura;R. Celestre;H. Padmore
通过物理气相沉积技术沉积在基底上的薄膜通常表现出大的残余应力，这可能是膜从其基底自发脱离的原因，并且在压缩应力的情况下，是薄膜屈曲的原因。虽然这些影响是不可取的未来的应用，人们可以利用它的薄膜机械性能的调查。自80年代以来，已经做了大量的理论工作，以开发力学模型，目的是更好地理解导致这种现象的驱动机制，从而提出解决方案，以避免此类问题。然而，在这个问题上，只有少数的实验工作已经做了支持这些理论结果，没有关于局部应力/应变测量主要是因为小尺寸的屈曲（几十毫米）。本文论述了同步辐射微束X射线衍射在金薄膜屈曲应力/应变成像分析中的应用。
Thin films deposited by Physical Vapour Deposition techniques on substrates generally exhibit large residual stresses which may be responsible of spontaneous detachment of the film from its substrate and in the case of compressive stresses, thin film buckling. Although these effects are undesirable for future applications, one may take benefit of it for thin film mechanical properties investigation. Since the 80's, a lot of theoretical works have been done to develop mechanical models with the aim to get a better understanding of driven mechanisms giving rise to this phenomenon and thus to propose solutions to avoid such problems. Nevertheless, only a few experimental works have been done on this subject to support these theoretical results and nothing concerning local stress/strain measurement mainly because of the small dimension of the buckling (few tenth mm). This paper deals with the application of micro beam x-ray diffraction available on synchrotron radiation sources for stress/ strain mapping analysis of gold thin film buckling.