Microstructured Silicone Substrate for Printable and Stretchable Metallic Films
Microstructured Silicone Substrate for Printable and Stretchable Metallic Films
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DOI：
10.1021/la103213n
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发表时间：
2011-04-19
期刊：
影响因子：
3.9
通讯作者：
Lacour, Stephanie P.
中科院分区：
文献类型：
--
作者：
Robinson, Adam P.;Minev, Ivan;Lacour, Stephanie P.
可拉伸电子产品（即集成在弹性体基板上的混合无机或有机电路）依赖于弹性布线。我们提出了一种通过将银基油墨印刷到微结构有机硅基材上来制造可逆拉伸金属薄膜的技术。通过改变硅树脂基底上图案化的微柱阵列的几何形状，可以调整和优化弹性体表面上墨水的润湿和钉扎。所得薄膜表现出高电导率（类似于 11 000 S/cm），并且可以可逆拉伸至 20% 应变超过 1000 次而不会出现电故障。 >= 200 nm 厚的金属薄膜的拉伸性依赖于图案化 PDMS 上印刷薄膜中的工程应变消除。
Stretchable electronics (i.e., hybrid inorganic or organic circuits integrated on elastomeric substrates) rely on elastic wiring. We present a technique for fabricating reversibly stretchable metallic films by printing silver-based ink onto microstructured silicone substrates. The wetting and pinning of the ink on the elastomer surface is adjusted and optimized by varying the geometry of micropillar arrays patterned on the silicone substrate. The resulting films exhibit high electrical conductivity (similar to 11 000 S/cm) and can stretch reversibly to 20% strain over 1000 times without failing electrically. The stretchability of the >= 200 nm thick metallic film relies on engineered strain relief in the printed film on patterned PDMS.