High Frequency Conducted EMI Investigation on Packaging and Modulation for a SiC-Based High Frequency Converter
High Frequency Conducted EMI Investigation on Packaging and Modulation for a SiC-Based High Frequency Converter
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DOI：
10.1109/jestpe.2019.2919349
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发表时间：
2019-09
影响因子：
5.5
通讯作者：
Yue Xie;Cai Chen;Zhizhao Huang;Teng Liu;Yong Kang;F. Luo
中科院分区：
文献类型：
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作者：
Yue Xie;Cai Chen;Zhizhao Huang;Teng Liu;Yong Kang;F. Luo
碳化硅（SiC）器件具有开关速度快、开关频率高的优点，可以提高功率密度，但随着开关频率的提高，电磁干扰（EMI）也会沿着增加，这对高频变换器来说是一个挑战。为了弄清SiC变换器中EMI噪声的影响因素并找到抑制方法，本文从封装结构和调制方法两个方面对SiC基高功率密度电子系统中的传导EMI进行了研究。在封装研究方面，将功率模块寄生参数引入EMI分析模型，定义EMI噪声传递函数，分析寄生参数对噪声传播路径的影响，并通过开关瞬态和频谱分析进一步研究寄生参数对噪声源的影响。基于混合结构SiC功率模块和分立SiC器件进行了分析和仿真，以验证分析结果。通过分析比较连续电流调制（CCM）和三角电流调制（TCM）两种调制方式，研究了调制方式对电磁干扰（EMI）的影响。为了验证分析研究，两个1.6千瓦，300 kHz的开关频率同步降压转换器的设计和测试。一种是基于混合封装的功率模块，另一种是基于TO-247封装的SiC器件，分别。结果表明，该混合封装模块在10 ~ 20 MHz频率范围内对共模电磁干扰（CM EMI）的抑制率可达10 dB，对差模电磁干扰（DM EMI）的抑制率可达10 dB。此外，TCM在低频范围内可以增加DM EMI，但在高频范围内可以抑制DM EMI。
Silicon carbide (SiC) devices have the advantages of high switching speed and high switching frequency, which can increase the power density, but electromagnetic interference (EMI) will increase along with higher switching frequency thus it can become a challenge for high-frequency converters. In order to clarify the influence factors of EMI noise in SiC converters and find the suppressing method, this paper investigated the conducted EMI in SiC-based high power density electronic systems from two aspects: packaging structures and modulation methods. For packaging investigation, this paper introduced parasitic parameters of power module into EMI analytical model, then defined transfer functions of EMI noise to analyze the influence of parasitic parameters on noise propagation path and further studied the impact of parasitic parameters on noise source by analyzing switching transient and frequency spectrum. Analysis and simulation are carried out based on a hybrid structure SiC power module and discrete SiC devices to verify the analysis. The influence of modulation on EMI is studied by analyzing and comparing two modulations: continuous current modulation (CCM) and triangle current modulation (TCM). To certify the analysis study, two 1.6-kW, 300-kHz switching-frequency synchronous buck converters are designed and tested. One is based on the hybrid packaging power module and the other is based on TO-247 packaged SiC devices, respectively. The result shows that the hybrid packaging module can suppress the common mode (CM) EMI by 10 dB, and has a suppression on differential mode (DM) EMI between 10 and 20 MHz. Moreover, TCM can increase DM EMI in low-frequency range but suppress it in the high-frequency range.