Metal-metal bonding process using Ag metallo-organic nanoparticles
Metal-metal bonding process using Ag metallo-organic nanoparticles
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DOI：
10.1016/j.actamat.2005.01.047
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发表时间：
2005-05-01
期刊：
影响因子：
9.4
通讯作者：
Kobayashi, KF
中科院分区：
文献类型：
--
作者：
Ide, E;Angata, S;Kobayashi, KF
我们提出了一种新的键合过程中使用银金属有机纳米粒子作为纳米技术的一个新的应用。Ag纳米颗粒的平均尺寸约为11 nm，每个颗粒都被有机壳覆盖。因此，它具有每个纳米颗粒独立存在的突出特点。然而，去除有机壳对于显现纳米颗粒的特性是必要的。通过热分析测定的分解温度为573 K以下，其热特性与作为其原料的肉豆蔻醇完全不同。在573 K的低键合温度下，在1或5 MPa的键合压力下，实现了使用Ag纳米颗粒的Cu到Cu的连接。接头的剪切强度为25-40 NPa，这显著高于使用尺寸为100 nm的Ag细颗粒制成的接头。这是因为将颗粒尺寸减小到纳米级改善了Ag颗粒的烧结和与Cu的结合性。透射电子显微镜观察表明，在与Ag纳米颗粒烧结的Cu和Ag层之间的界面处可以实现冶金结合。这种键合被认为是源于由纳米尺寸的颗粒所引起的大的表面能贡献。(c)2005 Acta Materialia Inc.由爱思唯尔有限公司出版。保留所有权利。
We propose a novel bonding process using Ag metallo-organic nanoparticles as a new application of nanotechnologies. The average size of the Ag nanoparticles is around 11 nm, and each particle is covered with an organic shell. Therefore, it has the outstanding feature that each nanoparticle exists independently. However, removal of the organic shell is necessary to bring out characteristics of the nanoparticle. Its decomposition temperature measured by thermal analysis is 573 K or less. In addition, it revealed that the thermal characteristic of the organic shell differed completely from Myristyl alcohol, from which the organic shell was derived. At a low bonding temperature of 573 K at a bonding pressure of 1 or 5 MPa, Cu-to-Cu joining using the Ag nanoparticles was achieved. The shear strength of the joints was 25-40 NPa, which was significantly higher than that made using Ag fine particles of 100 nm in size. That is because the reduction of the particle size to a nano-order improved the sintering of Ag particles and the bondability to Cu. Transmission electron microscope observations revealed that metallurgical bonding could be realized at the interface between the Cu and the Ag layer sintered with Ag nanoparticles. This bonding is suggested to originate from the large surface energy contribution caused by the nano-size particles. (c) 2005 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.