Metal Deposition Using Solutions on High-Density and Well-Aligned CNTs
Metal Deposition Using Solutions on High-Density and Well-Aligned CNTs
复制标题
使用高密度且排列良好的碳纳米管溶液进行金属沉积
DOI：
10.1109/estc48849.2020.9229813
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发表时间：
2020
期刊：
影响因子：
--
通讯作者：
Nishikawae Hiroshi
中科院分区：
文献类型：
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作者：
Saito Mikiko;Kuwae Hiroyuki;Mizuno Jun;Norimatsu Wataru;Kusunoki Michiko;Nishikawae Hiroshi
研究了在碳化硅衬底上制备高密度、高取向碳纳米管电沉积Co-Cu、Au-Ag薄膜和化学镀Au薄膜的工艺。通过电化学还原将PVP附着在碳纳米管/碳化硅表面，使碳纳米管表面亲水，水接触角从110°降至70°。电沉积Co-Cu后，D带向低波数方向移动，表明Co-Cu金属沉积在碳纳米管/碳化硅上的质量数增加。然而，这种Co-Cu电沉积膜的形貌与其亲水性无关。碳纳米管具有很高的导电性，可以很好地用作阴极。在钴-铜电沉积过程中，使用了高pH值和络合剂。这并不影响成核速率，但扩散速度影响反应速度。同时，用铂种子层形成的Au-Ag颗粒比用碳纳米管/碳化硅衬底形成的颗粒尺寸要小。由于碳纳米管/碳化硅的电导率小于铂的电导率，因此形核生成速率也不同。沉积池的组成也被认为与沉积机制有关。因此，要获得小尺寸的纳米碳管，就需要更高的电导率。最后，为了获得更精确的金属颗粒，进行了化学镀Au。氧等离子体处理后，被氧化的表面和内部的碳纳米管被沉积的金离子置换。通过透射电子显微镜分析和能谱分析，证实了金的沉积，其颗粒尺寸约为5 nm。对碳纳米管混合电沉积和化学镀金属进行了研究。结果表明，金属纳米颗粒促进了碳纳米管/碳化硅纳米颗粒的沉积，纳米颗粒的直径约为5 nm，具有良好的取向和高密度。
The preparation processes of Co-Cu and Au-Ag electrodeposited films and electroless Au films, using high-density and highly orientated CNTs on a SiC substrate, were investigated. The attachment via electrochemical reduction of PVP to the CNTs/SiC resulted in a hydrophilic CNTs surface the water contact angle reduced from 110° to 70°. After Co-Cu electrodeposition, the D-band shifted to a lower wavenumber, that indicated an increase in the mass number as Co-Cu metals deposited on the CNTS/SiC. However, the morphology of this Co-Cu electrodeposited film was not related to its hydrophilicity. The CNTs worked well as cathode electrodes because of their high conductivity. During the Co-Cu electrodeposition process, high pH and a complex agent were used. This did not affect the nucleation generation rate, however, the diffusion velocity affected the reaction velocity. Meanwhile, the Au-Ag particle sizes formed with a Pt seed layer were smaller than with the CNTs/SiC substrate. The nucleation generation rates were also different since CNTs/SiC conductivity was smaller than that of Pt. The deposition bath constitution was also thought to be connected to the deposition mechanism. Therefore, to obtain small-sized particles, a higher conductivity of CNTs was needed. Lastly, to obtain more precise metal particles, electroless Au deposition was carried out. After oxygen plasma treatment, the oxidized surface and inner CNTs were displaced by deposited Au ions. The deposition of Au, with particle size approximately 5 nm, was confirmed by TEM analysis and EDS mapping. CNTs mixed electrodeposition and electroless deposition of metals were also investigated. It was confirmed that metal nanoparticles enhanced the deposition of well aligned and high-density CNTs/SiC, with a diameter of 5 nm.