Negative correlation between in-plane bonding strength and cross-plane thermal conductivity in a model layered material
Negative correlation between in-plane bonding strength and cross-plane thermal conductivity in a model layered material
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DOI：
10.1063/1.4773372
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发表时间：
2013-01
影响因子：
4
通讯作者：
Zhiyong Wei;Yunfei Chen;C. Dames
中科院分区：
文献类型：
--
作者：
Zhiyong Wei;Yunfei Chen;C. Dames
采用分子动力学和晶格动力学方法研究了面内和跨面原子间键合强度对层状材料导热系数的影响。增加IP结合强度，同时保持CP结合常数增加IP热导率，但降低CP热导率。当增加CP结合强度同时保持IP结合恒定时，可以看到类似但较弱的趋势。这些结果表明，低和高对称性方向必须被认为是理解声子聚焦的影响，对高度各向异性材料的热导率张量。
The effects of in-plane (IP) and cross-plane (CP) interatomic bonding strengths on the IP and CP thermal conductivities of a model layered material are investigated using molecular dynamics and lattice dynamics. Increasing the IP bonding strength while holding the CP bonding constant increases the IP thermal conductivity, but reduces the CP thermal conductivity. Analogous but weaker trends are seen when increasing the CP bonding strength while holding the IP bonding constant. These results show how both low- and high-symmetry directions must be considered to understand the effects of phonon focusing on the thermal conductivity tensor of highly anisotropic materials.