Utilization of Steam-Treated and Milling-Treated Lignin from Moso Bamboo as Curing Agent of Epoxy Resin
Utilization of Steam-Treated and Milling-Treated Lignin from Moso Bamboo as Curing Agent of Epoxy Resin
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DOI：
10.1007/s12649-021-01444-8
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发表时间：
2021-04
影响因子：
3.2
通讯作者：
C. Asada;Koki Honjo;Y. Nakamura
中科院分区：
文献类型：
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作者：
C. Asada;Koki Honjo;Y. Nakamura
摘要以低分子量木质素为固化剂，合成了生物基固化环氧树脂。以毛竹为原料，采用10-40 atm蒸汽处理5 min，球磨处理10 s，然后用水和丙酮抽提的方法提取低分子量木质素。低分子量木质素丙酮可溶组分的数均分子量为554-698，重均分子量为1460-3240。此外，低分子量木质素的羟基当量为111-169 g-木质素/eq。木质素固化的环氧树脂由EP 828（商业二缩水甘油醚双酚A环氧树脂）与低分子量木质素作为固化剂制成。木质素固化的环氧树脂在5%重量损失下的分解温度（Td 5）为298-327 °C，并且使用低分子量木质素在30 atm下获得最大值，即327 °C。虽然Td 5随蒸汽压力而变化，但所有值均满足电子基板领域中耐焊接性所需的热稳定性，即超过250 °C。木质素固化的环氧树脂的拉伸强度为44-59 MPa，并且这些值满足商业固化的环氧树脂的拉伸强度，即超过27 MPa。
AbstractLow-molecular weight lignin was used as a curing agent to synthesize a bio-based cured epoxy resin. The low-molecular weight lignin was extracted from moso bamboo using steam treatment at 10–40 atm for 5 min followed by milling treatment for 10 s and then water and acetone extractions. The number and weight average molecular weight of low-molecular weight lignin, i.e. acetone soluble component, were 554–698 and 1460–3240, respectively. Furthermore, the hydroxyl equivalent of low-molecular weight lignin were 111–169 g-lignin/eq. The lignin-cured epoxy resin was made from EP828 (a commercial diglycidyl ether bisphenol A epoxy resin) with the low-molecular weight lignin as a curing agent. The decomposition temperature at 5% weight loss (Td5) of lignin-cured epoxy resins were 298–327 °C and the maximum value, i.e. 327 °C, was obtained using a low-molecular weight lignin at 30 atm. Though Td5varied with the steam pressure, all values satisfied the thermal stability property required for soldering resistance in the electronic substrate field, i.e. beyond 250 °C. The tensile strengths of lignin-cured epoxy resins were 44–59 MPa and these values satisfied the tensile strength of commercial cured epoxy resins, i.e. beyond 27 MPa.Graphic Abstract