Computational analysis of copper electrodeposition into a porous preform
Computational analysis of copper electrodeposition into a porous preform
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DOI：
10.1063/5.0086665
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发表时间：
2022-05
期刊：
影响因子：
1.6
通讯作者：
Md Emran Hossain Bhuiyan;M. Minary‐Jolandan
中科院分区：
文献类型：
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作者：
Md Emran Hossain Bhuiyan;M. Minary‐Jolandan
将金属电镀到具有导电壁的多孔预制体中，与结构复合材料、燃料电池和电池以及微电子的制造有关。电沉积工艺参数，如直流或脉冲电流、电势和电解质浓度，以及预制体几何形状，对工艺结果有重要影响，包括填充过程和渗透体积的百分比。虽然微电子应用中电镀成垂直互连通道（具有非导电壁）已经得到了广泛的研究，但“流过”电镀成具有有利壁的通道几何形状之前还没有研究过。在这里，首次使用计算分析研究了铜在这样一个通道中的渗透。系统地研究了入口流速、电位、电解质浓度和微通道几何形状的影响，以量化它们对电沉积速率、沉积锋均匀性和通道内渗透面积的影响。计算结果表明，在低外加电位、高电解质浓度和无流入速度条件下，未填充面积可减小到1%以下。该结果可用于指导涉及将金属电镀到多孔预制体的实验，以实现可靠和可重复的制造工艺。
Electroplating of metals into a porous preform with conductive walls is relevant in the fabrication of structural composites, fuel cells and batteries, and microelectronics. Electrodeposition process parameters, such as direct current or pulsed current, electric potential, and electrolyte concentration, as well as preform geometry, have important implications in the process outcomes including the filling process and the percentage of the infiltrated volume. Although electroplating into a vertical interconnect access (with nonconductive walls) for microelectronic applications has been extensively studied, the "flow-through" electroplating into a channel geometry with conducive walls has not been previously investigated. Here, copper infiltration into a such channel has been investigated using computational analysis for the first time. The effects of the inlet flow velocity, potential, electrolyte concentration, and microchannel geometry are systematically studied to quantify their influence on the electrodeposition rate, uniformity of the deposition front, and the infiltrated area within the channel. Computational results revealed that the unfilled area can be reduced to lower than 1% with a low applied potential, a high electrolyte concentration, and no inflow velocity. The results can be used to guide experiments involving electroplating metals into porous preforms toward reliable and reproducible manufacturing processes.