Experimental factors controlling analyte ion generation in laser desorption/ionization mass spectrometry on porous silicon
Experimental factors controlling analyte ion generation in laser desorption/ionization mass spectrometry on porous silicon
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DOI：
10.1021/ac010317x
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发表时间：
2001-08-01
影响因子：
7.4
通讯作者：
Sweedler, JV
中科院分区：
文献类型：
--
作者：
Kruse, RA;Li, XL;Sweedler, JV
多孔硅解吸/电离 (DIOS) 是一种相对较新的激光解吸/电离技术，用于对各种样品进行直接质谱分析，无需基质。使用最近开发的非电化学 H2O2-金属-HF 蚀刻作为多功能平台来制造多孔硅基板，用于研究多孔硅的形态和物理性质对 DIOS-MS 性能的影响。此外，还研究了激光波长、离子检测模式、pH 值和溶剂对解吸/电离过程的贡献。其他多孔基底（例如 GaAs 和 GaN）与多孔硅具有相似的表面特性，但热学和光学性质不同，可以研究表面积、光吸收和热导率在解吸/电离过程中的作用。在所研究的多孔半导体中，只有多孔硅具有在所研究的条件下有效生成分析物离子所需的大表面积、光吸收和导热性的组合。除了这些与底物相关的因素之外，还发现由沉积溶剂与表面的相互作用决定的表面润湿性和肽的电荷状态对于确定离子生成效率也很重要。
Desorption/ionization on porous silicon (DIOS) is a relatively new laser desorption/ionization technique for the direct mass spectrometric analysis of a wide variety of samples without the requirement of a matrix. Porous silicon substrates were fabricated using the recently developed nonelectrochemical H2O2-metal-HF etching as a versatile platform for investigating the effects of morphology and physical properties of porous silicon on DIOS-MS performance. In addition, laser wavelength, mode of ion detection, pH, and solvent contributions to the desorption/ionization process were studied. Other porous substrates such as GaAs and GaN, with similar surface characteristics but differing in thermal and optical properties from porous silicon, allowed the roles of surface area, optical absorption, and thermal conductivities in the desorption/ionization process to be investigated. Among the porous semiconductors studied, only porous silicon has the combination of large surface area, optical absorption, and thermal conductivity required for efficient analyte ion generation under the conditions studied. In addition to these substrate-related factors, surface wetting, determined by the interaction of deposition solvent with the surface, and charge state of the peptide were found to be important in determining ion generation efficiency.