Quality factor in trench-refilled polysilicon beam resonators
Quality factor in trench-refilled polysilicon beam resonators
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DOI：
10.1109/jmems.2006.876662
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发表时间：
2006-06-01
影响因子：
2.7
通讯作者：
Ayazi, Farrokh
中科院分区：
文献类型：
--
作者：
Abdolvand, Reza;Johari, Houri;Ayazi, Farrokh
本文研究了沟槽填充（TR）多晶硅微机电束流谐振器中的热弹性阻尼（TED）作为低频限制品质因子(Q)的机制。建立了基于齐纳理论的近似模型，并在FEMLAB中进行了数值模拟。根据所提出的模型，期望TR波束谐振器的质量因子随频率曲线具有双夹特性。为了实验验证该模型，制作了不同长度的等宽TR微谐振器，以覆盖较宽的频率范围。这些装置的频率响应与我们的模型吻合得很好。利用本文建立的理论和数值模型，可以预测TR波束谐振器或任何类似结构（如TR多晶硅陀螺）中质量因子的上界。
In this paper, thermoelastic damping (TED) in trench-refilled (TR) polysilicon microelectromechanical beam resonators is studied as a mechanism for limiting quality factor (Q) at low frequencies. An approximate model based on Zener's theory is developed and verified by numerical simulations in FEMLAB. According to the proposed model a double-clip characteristic is expected for the quality factor versus frequency curve of TR beam resonators. To verify the model experimentally, equal-width TR micro-resonators are fabricated in different length to cover a broad range of frequencies. Frequency response of these devices agrees well with our model. By using the theoretical and numerical models developed in this paper, an upper bound for the quality factor in TR beam resonators or any similar structure such as TR polysilicon gyros can be predicted.