The Novel Deflector for Multi Arrayed Microcolumn Using Microelectromechanical System (MEMS) Technology
The Novel Deflector for Multi Arrayed Microcolumn Using Microelectromechanical System (MEMS) Technology
复制标题
采用微机电系统（MEMS）技术的新型多阵列微柱偏转器
DOI：
10.1143/jjap.42.4084
复制
发表时间：
2003
影响因子：
1.5
通讯作者：
K. Chun
中科院分区：
文献类型：
--
作者：
H. Kim;Changho Han;K. Chun
本文描述了一种多阵列偏转器的新概念，通过利用微机电系统（MEMS）技术的制造技术（例如多晶片阳极键合技术和铜电镀）来生产双层结构，从而减少布线量。双层互连结构是一种新引入的互连方法，可以减少元件之间的布线。制作了具有内部布线结构的3×3阵列偏转器。新制作的偏转器的偏转性能显示出线性偏转结果。此外，使用具有等效电路模型的集成电路重点仿真程序（SPICE）来计算由多个互连结构引起的每个偏转器极之间的信号延迟的差异。计算结果显示存在大约3 ns 的信号延迟差异。因此，该方法对于检查信号延迟的差异非常有用。这项工作将有助于理解多阵列微柱系统的互连。
This paper describes a new concept for a multiple arrayed deflector with a reduced amount of wiring by utilizing a fabrication technique using microelectromechanical system (MEMS) technology, such as multi wafer anodic bonding techniques and copper electroplating in order to produce a double layer structure. The double layer interconnection structure is a newly introduced interconnection method that reduces wiring among the components. A 3×3 arrayed deflector, which has an internal wiring structure, was fabricated. The deflection performance of the newly fabricated deflector displayed linear deflection results. Moreover, the difference in the signal delay between each deflector pole, which was caused by multiple interconnection structures, was calculated using a simulation program with integrated circuit emphasis (SPICE) simulator with an equivalent circuit model. The calculation results showed there was an approximate 3 ns signal delay difference. Therefore, this method is very useful for checking the difference in the signal delay. This work will be helpful for understanding the interconnections a multiple arrayed microcolumn system.