Thermal Transport in Suspended and Supported Few-Layer Graphene
Thermal Transport in Suspended and Supported Few-Layer Graphene
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DOI：
10.1021/nl102923q
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发表时间：
2011-01-01
期刊：
影响因子：
10.8
通讯作者：
Thong, John T. L.
中科院分区：
文献类型：
--
作者：
Wang, Ziqian;Xie, Rongguo;Thong, John T. L.
我们报告的热导率（κ）测量从77至350 K的悬浮和支持的几层石墨烯使用热桥配置。对于最大的薄片，kappa的室温值与块状石墨的室温值相当，但是对于较小的薄片，kappa的室温值显著降低。基材的存在降低了kappa值，但对于顶层中远离基材的热传输，该效果减小。对于悬浮样品，kappa的温度依赖性遵循指数为1.4 +/-0.1的幂律，表明弯曲声子模式对悬浮石墨烯的热输运有显著贡献。Kappa的测量值通常低于理论研究的值。我们将这种偏差归因于石墨烯接触界面处的声子边界散射，这表明石墨烯的表观热导率显著降低。
We report thermal conductivity (kappa) measurements from 77 to 350 K on both suspended and supported few-layer graphene using a thermal-bridge configuration. The room temperature value of kappa is comparable to that of bulk graphite for the largest flake, but reduces significantly for smaller flakes. The presence of a substrate lowers the value of kappa, but the effect diminishes for the thermal transport in the top layers away from the substrate. For the suspended sample, the temperature dependence of kappa follows a power law with an exponent of 1.4 +/- 0.1, suggesting that the flexural phonon modes contribute significantly to the thermal transport of the suspended graphene. The measured values of kappa are generally lower than those from theoretical studies. We attribute this deviation to the phonon-boundary scattering at the graphene-contact interfaces, which is shown to significantly reduce the apparent measured thermal conductance of graphene.