Heat conduction enhanced shape-stabilized paraffin/HDPE composite PCMs by graphite addition: Preparation and thermal properties
Heat conduction enhanced shape-stabilized paraffin/HDPE composite PCMs by graphite addition: Preparation and thermal properties
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DOI：
10.1016/j.solmat.2010.05.020
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发表时间：
2010-10-01
影响因子：
6.9
通讯作者：
Wang, Jun
中科院分区：
文献类型：
--
作者：
Cheng, Wen-long;Zhang, Rong-ming;Wang, Jun
在本研究中，通过添加石墨粉（GP）和膨胀石墨（EG）提高了定形石蜡/高密度聚乙烯（HDPE）复合相变材料（PCM）的热导率。将不同质量分数的GP和EG添加到PCM中，并使用热盘热常数分析仪测量石蜡/HDPE/GP和石蜡/HDPE/EG复合材料的热导率。发现GP和EG添加剂的质量分数与PCM的热导率之间几乎呈线性关系。此外，分别通过扫描电子显微镜（SEM）和差示扫描量热法（DSC）研究了复合PCM的物理结构和热性能。实验结果表明，添加EG可大大提高定形石蜡/HDPE复合PCM的热导率。当EG的添加比例为4.6 wt%时，PCM的热导率高达1.36 W m⁻¹ K⁻¹，是无任何添加剂时的4倍多，远优于添加GP的情况。由于EG添加量少，导热增强型PCM的潜热降低很少，并且本文通过SEM证实了其良好的均匀结构。（C）2010 Elsevier B.V.保留所有权利。
In this study, the thermal conductivity of shape-stabilized paraffin/high density polyethylene (HDPE) composite phase change material (PCM) was improved by addition of graphite powder (GP) and expanded graphite (EG). GP and EG in different mass fractions were added to PCM, and thermal conductivities of paraffin/HDPE/GP and paraffin/HDPE/EG composites were measured by a Hot Disk Thermal Constant Analyzer. An almost linear relationship between mass fractions of GP and EG additives and thermal conductivity of PCMs was found. Furthermore, the physical structures and thermal properties of the composite PCMs were investigated by scanning electron microscope (SEM) and differential scanning calorimetry (DSC), respectively. The experimental results showed that the thermal conductivities of the shape-stabilized paraffin/HDPE composite PCMs could be greatly improved by addition of EG. When the addition of EG was in the ratio of 4.6 wt%, the thermal conductivity of the PCM was up to 1.36W m(-1) K-1, more than 4 times of that without any additives, which was much better than that by addition of GP. The latent heat of the heat conduction enhanced PCMs decreased little due to small amount of EG, and good uniformity structure was confirmed by SEM in this paper. (C) 2010 Elsevier B.V. All rights reserved.