Superconducting Multilayer High-Density Flexible Printed Circuit Board for Very High Thermal Resistance Interconnections
Superconducting Multilayer High-Density Flexible Printed Circuit Board for Very High Thermal Resistance Interconnections
复制标题
用于极高热阻互连的超导多层高密度柔性印刷电路板
DOI：
10.1007/s10909-018-1930-3
复制
发表时间：
2018
影响因子：
2
通讯作者：
A. Engel
中科院分区：
文献类型：
--
作者：
X. Broïse;A. Coguie;J. Sauvageot;C. Pigot;X. Coppolani;V. Moreau;S. d'Hollosy;Timur Knarosovski;A. Engel
摘要我们先后研制出两种低温超导柔性pcb。第一个是单层结构，包括552个磁道（10 μ m宽，20 μ m间距），可接收24个线键集成电路。第二种为多层，在两个屏蔽层之间有一个轨道层，通过微孔连接，包括37个轨道，两端可以通过线接或连接器连接。进行了首次冷测，取得了良好的效果。这些产品的新颖之处在于，首先，将超导材料与非常窄的间距和键合集成电路结合在一起，其次，引入了超导多层结构，通过通孔相互连接，据我们所知，这是世界上第一个。
AbstractWe have successively developed two superconducting flexible PCBs for cryogenic applications. The first one is monolayer, includes 552 tracks (10 µm wide, 20 µm spacing), and receives 24 wire-bonded integrated circuits. The second one is multilayer, with one track layer between two shielding layers interconnected by microvias, includes 37 tracks, and can be interconnected at both ends by wire bonding or by connectors. The first cold measurements have been performed and show good performances. The novelty of these products is, for the first one, the association of superconducting materials with very narrow pitch and bonded integrated circuits and, for the second one, the introduction of a superconducting multilayer structure interconnected by vias which is, to our knowledge, a world-first.