Three-Dimensional Hybrid Integration Technology of CMOS, MEMS, and Photonics Circuits for Optoelectronic Heterogeneous Integrated Systems
Three-Dimensional Hybrid Integration Technology of CMOS, MEMS, and Photonics Circuits for Optoelectronic Heterogeneous Integrated Systems
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DOI：
10.1109/ted.2010.2099870
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发表时间：
2011-03-01
影响因子：
3.1
通讯作者：
Koyanagi, Mitsumasa
中科院分区：
文献类型：
--
作者：
Lee, Kang-Wook;Noriki, Akihiro;Koyanagi, Mitsumasa
我们已经开发了一种新的互补金属氧化物半导体，微机电系统（MEMS）和光电子电路的光电异构集成系统的三维混合集成技术。我们已经克服了光机电和微流体混合集成的制造困难。为了验证所应用的三维混合集成技术，我们制作了一个由大规模集成电路（LSI）、MEMS和光子器件组成的三维光电多芯片组件。将幅移键控（ASK）LSI、无源和压力传感MEMS的电子芯片安装到具有硅通孔（TSV）和微流体通道的电Si中介层上。将垂直腔面发射激光器和光电二极管的光子学芯片嵌入到具有TSV的光学Si中介层中。电子和光学插入器精确地结合在一起，形成一个三维光电多芯片模块。光子器件和电子器件可以经由TSV进行通信。光子器件可以经由形成在光学内插器上的光波导连接。微流体通道通过晶片直接键合技术形成到插入器中，用于从高功率LSI散热。在本文中，我们评估的LSI，MEMS和光子器件的单个芯片的基本功能，因为它们被集成到3-D光电多芯片模块，以验证应用的3-D混合集成技术。大规模集成电路，无源，MEMS和光子器件的成功实现。三维混合集成技术为实现光电异构集成系统提供了一种强有力的解决方案。
We have developed a new 3-D hybrid integration technology of complementary metal-oxide-semiconductors, microelectromechanical systems (MEMS), and photonics circuits for optoelectronic heterogeneous integrated systems. We have overcome the fabrication difficulties of optoelectromechanical and microfluidics hybrid integration. In order to verify the applied 3-D hybrid integration technology, we fabricated a 3-D optoelectronic multichip module composed of large-scale integration (LSI), MEMS, and photonics devices. The electrical chips of amplitude-shift keying (ASK) LSI, passive, and pressure-sensing MEMS were mounted onto an electrical Si interposer with through-silicon vias (TSVs) and microfluidic channels. Photonics chips of vertical-cavity surface-emitting lasers and photodiodes were embedded into an optical Si interposer with TSVs. The electrical and optical interposers were precisely bonded together to form a 3-D optoelectronic multichip module. The photonics and electrical devices could communicate via TSVs. The photonics devices could be connected via an optical waveguide formed onto the optical interposer. Microfluidic channels were formed into the interposer by a wafer-direct bonding technique for heat sinking from high-power LSIs. In this paper, we evaluated the basic functions of individual chips of LSI, MEMS, and photonics devices as they were integrated into the 3-D optoelectronic multichip module to verify the applied 3-D hybrid integration technology. LSI, passive, MEMS, and photonics devices were successfully implemented. The 3-D hybrid integration technology is capable of providing a powerful solution for realizing optoelectronic heterogeneous integrated systems.