Evaluation of the Single Yeast Cell's Adhesion to ITO Substrates With Various Surface Energies via ESEM Nanorobotic Manipulation System

Evaluation of the Single Yeast Cell's Adhesion to ITO Substrates With Various Surface Energies via ESEM Nanorobotic Manipulation System
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DOI:
10.1109/tnb.2011.2177099
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发表时间:
2011-12
影响因子:
3.9
通讯作者:
Yajing Shen;Mohd Ridzuan Ahmad;M. Nakajima;S. Kojima;Michio Homma;Toshio Fukuda
Yajing Shen;Mohd Ridzuan Ahmad;M. Nakajima;S. Kojima;Michio Homma;Toshio Fukuda
中科院分区:
生物学3区
文献类型:
--
作者:
Yajing Shen;Mohd Ridzuan Ahmad;M. Nakajima;S. Kojima;Michio Homma;Toshio Fukuda

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细胞与表面的粘附力对细胞的活动和生物材料的开发具有重要意义。提出了一种基于环境扫描电子显微镜(ESEM)内纳米机器人操作系统的单细胞(W303)粘附力原位测量方法。采用聚焦离子束刻蚀技术,在商用原子力显微镜(AFM)悬臂梁上制作了一个末端执行器。用纳米操纵法标定了其弹簧常数。采用真空紫外辐照和OTS镀膜技术制备了三种亲水性和疏水性ITO薄膜。基于末端执行器的偏转测量单个酵母细胞对每个基底的剪切粘附强度。结果表明,在环境扫描电镜环境中,细胞粘附力在潮湿条件下比在含水条件下大。细胞对亲水表面的粘附力大于对疏水表面的粘附力。研究单细胞在不同表面和环境中的粘附,可以为组织工程和生物学领域提供新的视角。
Cell-surface adhesion force is important for cell activities and the development of biomaterials. In this paper, a method for in situ single cell (W303) adhesion force measurement was proposed based on nanorobotic manipulation system inside an environment scanning electron microscope (ESEM). An end effector was fabricated from a commercial atomic force microscope (AFM) cantilever by focused ion beam (FIB) etching. The spring constant of it was calibrated by nanomanipulation approach. Three kinds of hydrophilic and hydrophobic ITO plates were prepared by using VUV-irradiation and OTS coating techniques. The shear adhesion strength of the single yeast cell to each substrate was measured based on the deflection of the end effector. The results demonstrated that the cell adhesion force was larger under the wet condition in the ESEM environment than in the aqueous condition. It also showed that the cell adhesion force to hydrophilic surface was larger than that to the hydrophobic surface. Studies of single cell's adhesion on various plate surfaces and environments could give new insights into the tissue engineering and biological field.