Electrical and fluidic microbumps and interconnects for 3D-IC and silicon interposer
Electrical and fluidic microbumps and interconnects for 3D-IC and silicon interposer
复制标题
用于 3D-IC 和硅中介层的电气和流体微凸块和互连
DOI：
10.1109/socc.2012.6398388
复制
发表时间：
2012
期刊：
影响因子：
--
通讯作者：
M. Bakir
中科院分区：
文献类型：
--
作者：
Li Zheng;M. Bakir
高密度的微型聚集体（直径25μm和50μm螺距）和流体微圆柱对于支持3DICS和SILICON INTERPOSER的高性能高压芯片的高性能高功率芯片的高效率高功率芯片的高液体冷却很重要。在本文中证明了液体微圆柱。结果。
High-density electrical microbumps (25 μm diameter and 50 μm pitch) and fluidic microbumps are important to support high-bandwidth signaling, power delivery and microfluidic cooling of high-performance high-power chips in 3DICs and silicon interposer. Simultaneous fabrication of electrical and fluidic microbumps is demonstrated in this paper. Test vehicles are also fabricated for assembly. Four-point resistance measurements and preliminary fluidic testing demonstrate assembly results.